NSN 5961-00-024-8272 of Semiconductor Device Diode - Parts Details
Alternative NSN: 5961000248272 |
Item Name: Semiconductor Device Diode |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 000248272 |
NCB Code: USA (00) |
Manufacturers: Adelco Elektronik Gmbh , Lacon Electronic Gmbh , On Semiconductors , Freescale Semiconductor Inc , Quantegy Inc , Ampex Data Systems Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers MR2361A, MR2361, 013-875 under NSN 5961-00-024-8272 of Semiconductor Device Diode manufactured by Adelco Elektronik Gmbh, Lacon Electronic Gmbh, On Semiconductors, Freescale Semiconductor Inc, Quantegy Inc.
Federal Supply Class of NSN 5961-00-024-8272 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-024-8272, 5961000248272
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Part No Manufacturer Item Name QTY RFQ MR2361A Adelco Elektronik Gmbh semiconductor device diode Avl RFQ MR2361 Adelco Elektronik Gmbh semiconductor device diode Avl RFQ MR2361 Lacon Electronic Gmbh semiconductor device diode Avl RFQ MR2361 On Semiconductors semiconductor device diode Avl RFQ MR2361 Freescale Semiconductor Inc semiconductor device diode Avl RFQ 013-875 Quantegy Inc semiconductor device diode Avl RFQ 013-875 Ampex Data Systems Corporation semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961000248272MRC Criteria Characteristic ABHP OVERALL LENGTH 0.155 INCHES MAXIMUM ADAV OVERALL DIAMETER 0.090 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.155 INCHES MAXIMUM |
ADAV | OVERALL DIAMETER | 0.090 INCHES MAXIMUM |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |