NSN 5961-00-078-9592 of Semiconductor Device Photo - Parts Details
| Alternative NSN: 5961000789592 |
| Item Name: Semiconductor Device Photo |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 000789592 |
| NCB Code: USA (00) |
| Manufacturers: Electronic Industries Association , Texas Instrument Inc , Dla Land And Maritime , Micropac Industries Inc , Inspektorat Wsparcia Sil Zbrojnych , Rockwell Collins Inc , Hewlett Packard Co , Avago Technologies Us Inc Division |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers RELEASE4679, LS400, L01308, GS2020-3, DMS 81082B under NSN 5961-00-078-9592 of Semiconductor Device Photo manufactured by Electronic Industries Association, Texas Instrument Inc, Dla Land And Maritime, Micropac Industries Inc, Inspektorat Wsparcia Sil Zbrojnych.
Federal Supply Class of NSN 5961-00-078-9592 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-078-9592, 5961000789592
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Part No Manufacturer Item Name QTY RFQ RELEASE4679 Electronic Industries Association semiconductor device photo Avl RFQ LS400 Texas Instrument Inc semiconductor device photo Avl RFQ L01308 Dla Land And Maritime semiconductor device photo Avl RFQ GS2020-3 Micropac Industries Inc semiconductor device photo Avl RFQ DMS 81082B Dla Land And Maritime semiconductor device photo Avl RFQ 5980PL0827936 Inspektorat Wsparcia Sil Zbrojnych semiconductor device photo Avl RFQ 353-0291-010 Rockwell Collins Inc semiconductor device photo Avl RFQ 1N4378 Electronic Industries Association semiconductor device photo Avl RFQ 1N4378 Texas Instrument Inc semiconductor device photo Avl RFQ 1990-0042 Hewlett Packard Co semiconductor device photo Avl RFQ 1990-0042 Avago Technologies Us Inc Division semiconductor device photo Avl RFQ
Characteristics Data of NSN 5961000789592MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.600 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.300 INCHES MINIMUM ADAV OVERALL DIAMETER 0.081 INCHES MAXIMUM ALAS INTERNAL CONFIGURATION JUNCTION CONTACT AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 50.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN AND 6.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR TO EMITTER, SUSTAINED CTQX CURRENT RATING PER CHARACTERISTIC 100.00 MICROAMPERES SOURCE CUTOFF CURRENT MAXIMUM CTRD POWER RATING PER CHARACTERISTIC 50.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 125.0 DEG CELSIUS JUNCTION FEAT SPECIAL FEATURES JUNCTION PATTERN ARRANGEMENT: NPN TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD AND 1 CASE
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.600 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.300 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.081 INCHES MAXIMUM |
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 50.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN AND 6.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR TO EMITTER, SUSTAINED |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MICROAMPERES SOURCE CUTOFF CURRENT MAXIMUM |
| CTRD | POWER RATING PER CHARACTERISTIC | 50.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS JUNCTION |
| FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD AND 1 CASE |