NSN 5961-00-137-5513 of Semiconductor Device Diode - Parts Details
| Alternative NSN: 5961001375513 |
| Item Name: Semiconductor Device Diode |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 001375513 |
| NCB Code: USA (00) |
| Manufacturers: Cober Electronics Inc , Semic Rf Electronic Gmbh , Hewlett Packard Co , Ampex Data Systems Corporation , Avago Technologies Us Inc Division , Cardion Inc , Target Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers MA43872, HPA0113, 581-246, 5082-0113, 402663-1 under NSN 5961-00-137-5513 of Semiconductor Device Diode manufactured by Cober Electronics Inc, Semic Rf Electronic Gmbh, Hewlett Packard Co, Ampex Data Systems Corporation, Avago Technologies Us Inc Division.
Federal Supply Class of NSN 5961-00-137-5513 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-137-5513, 5961001375513
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Part No Manufacturer Item Name QTY RFQ MA43872 Cober Electronics Inc semiconductor device diode Avl RFQ MA43872 Semic Rf Electronic Gmbh semiconductor device diode Avl RFQ HPA0113 Hewlett Packard Co semiconductor device diode Avl RFQ 581-246 Ampex Data Systems Corporation semiconductor device diode Avl RFQ 5082-0113 Cober Electronics Inc semiconductor device diode Avl RFQ 5082-0113 Hewlett Packard Co semiconductor device diode Avl RFQ 5082-0113 Avago Technologies Us Inc Division semiconductor device diode Avl RFQ 402663-1 Cardion Inc semiconductor device diode Avl RFQ 402663-1 Target Corp semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961001375513MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.300 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.000 INCHES MINIMUM ADAV OVERALL DIAMETER 0.107 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC -35.0 MAXIMUM REVERSE BREAKDOWN VOLTAGE, DC CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 200.0 DEG CELSIUS AMBIENT AIR TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.300 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.107 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -35.0 MAXIMUM REVERSE BREAKDOWN VOLTAGE, DC |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS AMBIENT AIR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |