NSN 5961-00-137-8080 of Semiconductor Device Diode - Parts Details
| Alternative NSN: 5961001378080 |
| Item Name: Semiconductor Device Diode |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 001378080 |
| NCB Code: USA (00) |
| Manufacturers: Semi General Inc , Avago Technologies Us Inc Division , Hewlett Packard Co , Butler National Corp , Tadiran Ltd , Thales Communications Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UX941-038-0001, HP5082-8753, HP5082-3039, B162002-0000, 5921226 under NSN 5961-00-137-8080 of Semiconductor Device Diode manufactured by Semi General Inc, Avago Technologies Us Inc Division, Hewlett Packard Co, Butler National Corp, Tadiran Ltd.
Federal Supply Class of NSN 5961-00-137-8080 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-137-8080, 5961001378080
-
Part No Manufacturer Item Name QTY RFQ UX941-038-0001 Semi General Inc semiconductor device diode Avl RFQ HP5082-8753 Avago Technologies Us Inc Division semiconductor device diode Avl RFQ HP5082-8753 Hewlett Packard Co semiconductor device diode Avl RFQ HP5082-3039 Hewlett Packard Co semiconductor device diode Avl RFQ HP5082-3039 Avago Technologies Us Inc Division semiconductor device diode Avl RFQ B162002-0000 Butler National Corp semiconductor device diode Avl RFQ 5921226 Tadiran Ltd semiconductor device diode Avl RFQ 5082-8753 Avago Technologies Us Inc Division semiconductor device diode Avl RFQ 5082-8753 Hewlett Packard Co semiconductor device diode Avl RFQ 134620-0000 Thales Communications Inc semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961001378080MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM ADAV OVERALL DIAMETER 0.068 INCHES MINIMUM AND 0.076 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 100.0 MINIMUM BREAKDOWN VOLTAGE, DC CTRG CAPACITANCE RATING IN PICOFARADS 0.4 MAXIMUM CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS AMBIENT AIR TEST TEST DATA DOCUMENT 95542-941-038 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.068 INCHES MINIMUM AND 0.076 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 0.4 MAXIMUM |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| TEST | TEST DATA DOCUMENT | 95542-941-038 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |