NSN 5961-00-147-0107 of Semiconductor Device Diode - Parts Details
| Alternative NSN: 5961001470107 |
| Item Name: Semiconductor Device Diode |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 001470107 |
| NCB Code: USA (00) |
| Manufacturers: Freescale Semiconductor Inc , On Semiconductors , Siemens Corp , Microsemi Corporation , Telcom Semiconductor Inc , Hewlett Packard Co , Avago Technologies Us Inc Division |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SZ30016-50, SZ10939-50, DZ730818J, CD35574, 48A51608C50 under NSN 5961-00-147-0107 of Semiconductor Device Diode manufactured by Freescale Semiconductor Inc, On Semiconductors, Siemens Corp, Microsemi Corporation, Telcom Semiconductor Inc.
Federal Supply Class of NSN 5961-00-147-0107 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-147-0107, 5961001470107
-
Part No Manufacturer Item Name QTY RFQ SZ30016-50 Freescale Semiconductor Inc semiconductor device diode Avl RFQ SZ10939-50 Freescale Semiconductor Inc semiconductor device diode Avl RFQ SZ10939-50 On Semiconductors semiconductor device diode Avl RFQ DZ730818J Siemens Corp semiconductor device diode Avl RFQ DZ730818J Microsemi Corporation semiconductor device diode Avl RFQ CD35574 Telcom Semiconductor Inc semiconductor device diode Avl RFQ 48A51608C50 Freescale Semiconductor Inc semiconductor device diode Avl RFQ 1902-3048 Hewlett Packard Co semiconductor device diode Avl RFQ 1902-3048 Avago Technologies Us Inc Division semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961001470107MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.300 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.000 INCHES MINIMUM ADAV OVERALL DIAMETER 0.150 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 3.5 MAXIMUM NOMINAL REGULATOR VOLTAGE CTRD POWER RATING PER CHARACTERISTIC 0.4 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.300 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.150 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 3.5 MAXIMUM NOMINAL REGULATOR VOLTAGE |
| CTRD | POWER RATING PER CHARACTERISTIC | 0.4 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |