NSN 5961-00-175-2844 of Semiconductor Device Set - Parts Details
| Alternative NSN: 5961001752844 |
| Item Name: Semiconductor Device Set |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 001752844 |
| NCB Code: USA (00) |
| Manufacturers: Semi General Inc , Micrometrics Inc , Hewlett Packard Co , Fei Microwave Inc , Frequency Electronics Inc , Avago Technologies Us Inc Division |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UX2712, HP5082-2712, F10NB-L01-0001, A2S713M, 5082-2712 under NSN 5961-00-175-2844 of Semiconductor Device Set manufactured by Semi General Inc, Micrometrics Inc, Hewlett Packard Co, Fei Microwave Inc, Frequency Electronics Inc.
Federal Supply Class of NSN 5961-00-175-2844 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-175-2844, 5961001752844
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Part No Manufacturer Item Name QTY RFQ UX2712 Semi General Inc semiconductor device set Avl RFQ UX2712 Micrometrics Inc semiconductor device set Avl RFQ HP5082-2712 Hewlett Packard Co semiconductor device set Avl RFQ F10NB-L01-0001 Fei Microwave Inc semiconductor device set Avl RFQ F10NB-L01-0001 Frequency Electronics Inc semiconductor device set Avl RFQ A2S713M Fei Microwave Inc semiconductor device set Avl RFQ A2S713M Frequency Electronics Inc semiconductor device set Avl RFQ 5082-2712 Avago Technologies Us Inc Division semiconductor device set Avl RFQ 5082-2712 Hewlett Packard Co semiconductor device set Avl RFQ
Characteristics Data of NSN 5961001752844MRC Criteria Characteristic ABBH INCLOSURE MATERIAL CERAMIC ALL SEMICONDUCTOR DEVICE DIODE ABHP OVERALL LENGTH 0.190 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.210 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE ADAV OVERALL DIAMETER 0.078 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.084 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE AFZC FUNCTION FOR WHICH DESIGNED DETECTOR AND MIXER ASDD COMPONENT FUNCTION RELATIONSHIP MATCHED ASKA COMPONENT NAME AND QUANTITY 2 SEMICONDUCTOR DEVICE DIODE AXGY MOUNTING METHOD PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE CTMZ SEMICONDUCTOR MATERIAL SILICON ALL SEMICONDUCTOR DEVICE DIODE CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS JUNCTION ALL SEMICONDUCTOR DEVICE DIODE FEAT SPECIAL FEATURES 9.3 GHZ TEST FREQUENCY; 6.5 DECIBEL NOISE FIGURE TTQY TERMINAL TYPE AND QUANTITY 2 BINDING POST ALL SEMICONDUCTOR DEVICE DIODE
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | CERAMIC ALL SEMICONDUCTOR DEVICE DIODE |
| ABHP | OVERALL LENGTH | 0.190 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.210 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
| ADAV | OVERALL DIAMETER | 0.078 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.084 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
| AFZC | FUNCTION FOR WHICH DESIGNED | DETECTOR AND MIXER |
| ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION ALL SEMICONDUCTOR DEVICE DIODE |
| FEAT | SPECIAL FEATURES | 9.3 GHZ TEST FREQUENCY; 6.5 DECIBEL NOISE FIGURE |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BINDING POST ALL SEMICONDUCTOR DEVICE DIODE |