NSN 5961-00-180-4180 of Semiconductor Device Diode - Parts Details
Alternative NSN: 5961001804180 |
Item Name: Semiconductor Device Diode |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 001804180 |
NCB Code: USA (00) |
Manufacturers: General Dynamics C4 Systems Inc , Motorola Inc , Freescale Semiconductor Inc , Hewlett Packard Co , Avago Technologies Us Inc Division |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SMV315-211, 0122-0211 under NSN 5961-00-180-4180 of Semiconductor Device Diode manufactured by General Dynamics C4 Systems Inc, Motorola Inc, Freescale Semiconductor Inc, Hewlett Packard Co, Avago Technologies Us Inc Division.
Federal Supply Class of NSN 5961-00-180-4180 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-180-4180, 5961001804180
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Part No Manufacturer Item Name QTY RFQ SMV315-211 General Dynamics C4 Systems Inc semiconductor device diode Avl RFQ SMV315-211 Motorola Inc semiconductor device diode Avl RFQ SMV315-211 Freescale Semiconductor Inc semiconductor device diode Avl RFQ 0122-0211 Hewlett Packard Co semiconductor device diode Avl RFQ 0122-0211 Avago Technologies Us Inc Division semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961001804180MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.300 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.000 INCHES MINIMUM ADAV OVERALL DIAMETER 0.107 INCHES MAXIMUM ALAZ JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION DO-7 AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQX CURRENT RATING PER CHARACTERISTIC 250.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC CTRD POWER RATING PER CHARACTERISTIC 400.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR ABSOLUTE TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 0.300 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
ADAV | OVERALL DIAMETER | 0.107 INCHES MAXIMUM |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-7 |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQX | CURRENT RATING PER CHARACTERISTIC | 250.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
CTRD | POWER RATING PER CHARACTERISTIC | 400.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR ABSOLUTE |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |