NSN 5961-00-405-7905 of Semiconductor Device Diode - Parts Details
Alternative NSN: 5961004057905 |
Item Name: Semiconductor Device Diode |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 004057905 |
NCB Code: USA (00) |
Manufacturers: Micro Uspd Inc , Semtech Corporation , L 3 Communications , Diehl Aerospace Gmbh , Eads Deutschland Gmbh Verteidig , Telefunken Gmbh , Tadiran Ltd , Raytheon Aircraft , Honeywell International Inc , Cecom Lr Center , Systron Donner Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UT920A, SS1M, S12002-202, N62-00069, 5L.5532.405.11 under NSN 5961-00-405-7905 of Semiconductor Device Diode manufactured by Micro Uspd Inc, Semtech Corporation, L 3 Communications, Diehl Aerospace Gmbh, Eads Deutschland Gmbh Verteidig.
Federal Supply Class of NSN 5961-00-405-7905 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-405-7905, 5961004057905
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Part No Manufacturer Item Name QTY RFQ UT920A Micro Uspd Inc semiconductor device diode Avl RFQ SS1M Semtech Corporation semiconductor device diode Avl RFQ S12002-202 L 3 Communications semiconductor device diode Avl RFQ N62-00069 Diehl Aerospace Gmbh semiconductor device diode Avl RFQ 5L.5532.405.11 Eads Deutschland Gmbh Verteidig semiconductor device diode Avl RFQ 5L.5532.405.11 Telefunken Gmbh semiconductor device diode Avl RFQ 5921222 Tadiran Ltd semiconductor device diode Avl RFQ 5039-508 Raytheon Aircraft semiconductor device diode Avl RFQ 2503645-209 Honeywell International Inc semiconductor device diode Avl RFQ 13218E3253 Cecom Lr Center semiconductor device diode Avl RFQ 106555 Systron Donner Corp semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961004057905MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.165 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.292 INCHES MAXIMUM ADAV OVERALL DIAMETER 0.110 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 200.0 MAXIMUM REVERSE VOLTAGE, PEAK CTQX CURRENT RATING PER CHARACTERISTIC 1.00 MILLIAMPERES FORWARD CURRENT, AVERAGE MAJOR TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 0.165 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 1.292 INCHES MAXIMUM |
ADAV | OVERALL DIAMETER | 0.110 INCHES MAXIMUM |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 200.0 MAXIMUM REVERSE VOLTAGE, PEAK |
CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 MILLIAMPERES FORWARD CURRENT, AVERAGE MAJOR |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |