NSN 5961-00-539-3439 of Semiconductor Device Diode - Parts Details
| Alternative NSN: 5961005393439 |
| Item Name: Semiconductor Device Diode |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 005393439 |
| NCB Code: USA (00) |
| Manufacturers: Semi General Inc , Micrometrics Inc , Avago Technologies Us Inc Division , Hewlett Packard Co , Texas Instrument Inc , Aeroflex Limited , Cober Electronics Inc , Fei Microwave Inc , Raytheon Aircraft |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UX3802, QSCH-3802, ND0015-2, MX3819, MD0213 under NSN 5961-00-539-3439 of Semiconductor Device Diode manufactured by Semi General Inc, Micrometrics Inc, Avago Technologies Us Inc Division, Hewlett Packard Co, Texas Instrument Inc.
Federal Supply Class of NSN 5961-00-539-3439 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-539-3439, 5961005393439
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Part No Manufacturer Item Name QTY RFQ UX3802 Semi General Inc semiconductor device diode Avl RFQ UX3802 Micrometrics Inc semiconductor device diode Avl RFQ QSCH-3802 Avago Technologies Us Inc Division semiconductor device diode Avl RFQ QSCH-3802 Hewlett Packard Co semiconductor device diode Avl RFQ ND0015-2 Texas Instrument Inc semiconductor device diode Avl RFQ MX3819 Aeroflex Limited semiconductor device diode Avl RFQ MD0213 Texas Instrument Inc semiconductor device diode Avl RFQ A2X2323 Cober Electronics Inc semiconductor device diode Avl RFQ A2X2323 Fei Microwave Inc semiconductor device diode Avl RFQ 534314-4 Raytheon Aircraft semiconductor device diode Avl RFQ 534314-2 Raytheon Aircraft semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961005393439MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS AND METAL ABHP OVERALL LENGTH 0.090 INCHES NOMINAL ABJT TERMINAL LENGTH 0.065 INCHES MAXIMUM ADAV OVERALL DIAMETER 0.121 INCHES NOMINAL AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 0.7 MAXIMUM FORWARD VOLTAGE, AVERAGE CTQX CURRENT RATING PER CHARACTERISTIC 100.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS JUNCTION TTQY TERMINAL TYPE AND QUANTITY 2 FERRULE
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS AND METAL |
| ABHP | OVERALL LENGTH | 0.090 INCHES NOMINAL |
| ABJT | TERMINAL LENGTH | 0.065 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.121 INCHES NOMINAL |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 0.7 MAXIMUM FORWARD VOLTAGE, AVERAGE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 FERRULE |