NSN 5961-00-758-6075 of Semiconductor Device Diode - Parts Details
| Alternative NSN: 5961007586075 |
| Item Name: Semiconductor Device Diode |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 007586075 |
| NCB Code: USA (00) |
| Manufacturers: Gilbert Engineering Co Inc Incon , Boonton Electronics Corporation , Kontron America Incorporated , Interstate Electronics Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SG113, 530040, 343-212-035 under NSN 5961-00-758-6075 of Semiconductor Device Diode manufactured by Gilbert Engineering Co Inc Incon, Boonton Electronics Corporation, Kontron America Incorporated, Interstate Electronics Corporation.
Federal Supply Class of NSN 5961-00-758-6075 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-758-6075, 5961007586075
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Part No Manufacturer Item Name QTY RFQ SG113 Gilbert Engineering Co Inc Incon semiconductor device diode Avl RFQ 530040 Boonton Electronics Corporation semiconductor device diode Avl RFQ 530040 Kontron America Incorporated semiconductor device diode Avl RFQ 343-212-035 Interstate Electronics Corporation semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961007586075MRC Criteria Characteristic ABHP OVERALL LENGTH 0.300 INCHES MAXIMUM ABJT TERMINAL LENGTH 1.000 INCHES MINIMUM ADAV OVERALL DIAMETER 0.125 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.300 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.125 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |