NSN 5961-00-838-1700 of Semiconductor Device Diode - Parts Details
| Alternative NSN: 5961008381700 |
| Item Name: Semiconductor Device Diode |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 008381700 |
| NCB Code: USA (00) |
| Manufacturers: Dpa Labs Inc , Ogden Air Logistics Center , Boeing Company , Telcom Semiconductor Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 8746940-01, 479-0007-001, 341M under NSN 5961-00-838-1700 of Semiconductor Device Diode manufactured by Dpa Labs Inc, Ogden Air Logistics Center, Boeing Company, Telcom Semiconductor Inc.
Federal Supply Class of NSN 5961-00-838-1700 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-838-1700, 5961008381700
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Part No Manufacturer Item Name QTY RFQ 8746940-01 Dpa Labs Inc semiconductor device diode Avl RFQ 8746940-01 Ogden Air Logistics Center semiconductor device diode Avl RFQ 479-0007-001 Boeing Company semiconductor device diode Avl RFQ 341M Telcom Semiconductor Inc semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961008381700MRC Criteria Characteristic CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |