NSN 5961-00-914-3087 of Semiconductor Device Diode - Parts Details
Alternative NSN: 5961009143087 |
Item Name: Semiconductor Device Diode |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 009143087 |
NCB Code: USA (00) |
Manufacturers: Freescale Semiconductor Inc , On Semiconductors , American Shizuki Corp , Fairchild Semiconductor Corp , Microsemi Corporation , Telcom Semiconductor Inc , Avago Technologies Us Inc Division , Hewlett Packard Co |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SZ30016-182, SZ10939-182, PS18260A, FZ7260, DZ730820N under NSN 5961-00-914-3087 of Semiconductor Device Diode manufactured by Freescale Semiconductor Inc, On Semiconductors, American Shizuki Corp, Fairchild Semiconductor Corp, Microsemi Corporation.
Federal Supply Class of NSN 5961-00-914-3087 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-914-3087, 5961009143087
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Part No Manufacturer Item Name QTY RFQ SZ30016-182 Freescale Semiconductor Inc semiconductor device diode Avl RFQ SZ10939-182 Freescale Semiconductor Inc semiconductor device diode Avl RFQ SZ10939-182 On Semiconductors semiconductor device diode Avl RFQ PS18260A American Shizuki Corp semiconductor device diode Avl RFQ FZ7260 Fairchild Semiconductor Corp semiconductor device diode Avl RFQ DZ730820N Microsemi Corporation semiconductor device diode Avl RFQ CD35706 Telcom Semiconductor Inc semiconductor device diode Avl RFQ 1902-0025 Avago Technologies Us Inc Division semiconductor device diode Avl RFQ 1902-0025 Hewlett Packard Co semiconductor device diode Avl RFQ 10939-182 Freescale Semiconductor Inc semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961009143087MRC Criteria Characteristic AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
MRC | Criteria | Characteristic |
---|---|---|
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |