NSN 5961-00-929-2967 of Transistor - Parts Details
| Alternative NSN: 5961009292967 |
| Item Name: Transistor |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 009292967 |
| NCB Code: USA (00) |
| Manufacturers: Thales Nederland , Electronic Industries Association , Meggitt Aircraft Braking Systems , Newark Electronics , Esco Corp , Freescale Semiconductor Inc , Texas Instrument Inc , Bae Systems |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers VBE890-2N3495, RELEASE4831, 40-666-5233, 352250010232, 2N3495 under NSN 5961-00-929-2967 of Transistor manufactured by Thales Nederland, Electronic Industries Association, Meggitt Aircraft Braking Systems, Newark Electronics, Esco Corp.
Federal Supply Class of NSN 5961-00-929-2967 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-00-929-2967, 5961009292967
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Part No Manufacturer Item Name QTY RFQ VBE890-2N3495 Thales Nederland transistor Avl RFQ RELEASE4831 Electronic Industries Association transistor Avl RFQ 40-666-5233 Meggitt Aircraft Braking Systems transistor Avl RFQ 352250010232 Thales Nederland transistor Avl RFQ 2N3495 Newark Electronics transistor Avl RFQ 2N3495 Electronic Industries Association transistor Avl RFQ 2N3495 Esco Corp transistor Avl RFQ 2N3495 Freescale Semiconductor Inc transistor Avl RFQ 2N3495 Texas Instrument Inc transistor Avl RFQ 207037P2 Bae Systems transistor Avl RFQ
Characteristics Data of NSN 5961009292967MRC Criteria Characteristic ALAS INTERNAL CONFIGURATION JUNCTION CONTACT CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ III SEMICONDUCTOR MATERIAL SILICON FEAT SPECIAL FEATURES JUNCTION PATTERN ARRANGEMENT: PNP TTQY TERMINAL TYPE AND QUANTITY 3 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNP |
| TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |