NSN 5961-01-013-0960 of Rectifier Semiconductor Device - Parts Details
| Alternative NSN: 5961010130960 |
| Item Name: Rectifier Semiconductor Device |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 010130960 |
| NCB Code: USA (01) |
| Manufacturers: Micropac Industries Inc , L 3 Communications , Butler National Corp , Thales Communications Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers H471, B160003-0000, 160003-000000, 134784-0000 under NSN 5961-01-013-0960 of Rectifier Semiconductor Device manufactured by Micropac Industries Inc, L 3 Communications, Butler National Corp, Thales Communications Inc.
Federal Supply Class of NSN 5961-01-013-0960 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-01-013-0960, 5961010130960
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Part No Manufacturer Item Name QTY RFQ H471 Micropac Industries Inc rectifier semiconductor device Avl RFQ H471 L 3 Communications rectifier semiconductor device Avl RFQ B160003-0000 Butler National Corp rectifier semiconductor device Avl RFQ 160003-000000 Butler National Corp rectifier semiconductor device Avl RFQ 134784-0000 Thales Communications Inc rectifier semiconductor device Avl RFQ
Characteristics Data of NSN 5961010130960MRC Criteria Characteristic ABHP OVERALL LENGTH 1.850 INCHES MAXIMUM ABKW OVERALL HEIGHT 0.740 INCHES MAXIMUM ABMK OVERALL WIDTH 1.850 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -30.0/+100.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION DISTANCE MEASURING EQUIPMENT (DME) AJUR CIRCUIT CONNECTION STYLE DESIGNATOR BRIDGE 1 PHASE AXGY MOUNTING METHOD UNTHREADED HOLE FEAT SPECIAL FEATURES GROUNDED TERMINAL NOT INCLUDED; RESISTIVE LOAD; MOUNTING HOLE 0.187 IN.DIA; HERMETICALLY SEALED; 4.2 KILOVOLTRMS AND 650.000 MILLIAMPERES DC MATT III MATERIAL SILICON TTQY TERMINAL TYPE AND QUANTITY 4 TAB, SOLDER LUG
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 1.850 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.740 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 1.850 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -30.0/+100.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | DISTANCE MEASURING EQUIPMENT (DME) |
| AJUR | CIRCUIT CONNECTION STYLE DESIGNATOR | BRIDGE 1 PHASE |
| AXGY | MOUNTING METHOD | UNTHREADED HOLE |
| FEAT | SPECIAL FEATURES | GROUNDED TERMINAL NOT INCLUDED; RESISTIVE LOAD; MOUNTING HOLE 0.187 IN.DIA; HERMETICALLY SEALED; 4.2 KILOVOLTRMS AND 650.000 MILLIAMPERES DC |
| MATT | III MATERIAL | SILICON |
| TTQY | TERMINAL TYPE AND QUANTITY | 4 TAB, SOLDER LUG |