NSN 5961-01-093-8637 of Semiconductor Device Diode - Parts Details
Alternative NSN: 5961010938637 |
Item Name: Semiconductor Device Diode |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 010938637 |
NCB Code: USA (01) |
Manufacturers: Micrometrics Inc , Semi General Inc , Itt Cannon , Skyworks Solutions Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UX5754, G390216-1, D5754 under NSN 5961-01-093-8637 of Semiconductor Device Diode manufactured by Micrometrics Inc, Semi General Inc, Itt Cannon, Skyworks Solutions Inc.
Federal Supply Class of NSN 5961-01-093-8637 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-01-093-8637, 5961010938637
Characteristics Data of NSN 5961010938637MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.076 INCHES NOMINAL ADAV OVERALL DIAMETER 0.083 INCHES NOMINAL AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS AMBIENT AIR TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 0.076 INCHES NOMINAL |
ADAV | OVERALL DIAMETER | 0.083 INCHES NOMINAL |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |