NSN 5961-01-149-4743 of Semiconductor Devices Unitized - Parts Details
Alternative NSN: 5961011494743 |
Item Name: Semiconductor Devices Unitized |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 011494743 |
NCB Code: USA (01) |
Manufacturers: Aeroflex Weinschel Inc , Autek Systems Corp , Avago Technologies Us Inc Division , Hewlett Packard Co , Leviton Manufacturing Co Inc , Magnetic Peripherals Inc Normand , Intersil Corporation , Rca Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 15-09-3096E, 155-0680, 1858-0054, 37-0267, 50213100 under NSN 5961-01-149-4743 of Semiconductor Devices Unitized manufactured by Aeroflex Weinschel Inc, Autek Systems Corp, Avago Technologies Us Inc Division, Hewlett Packard Co, Leviton Manufacturing Co Inc.
Federal Supply Class of NSN 5961-01-149-4743 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-01-149-4743, 5961011494743
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Part No Manufacturer Item Name QTY RFQ 15-09-3096E Aeroflex Weinschel Inc semiconductor devices unitized Avl RFQ 155-0680 Autek Systems Corp semiconductor devices unitized Avl RFQ 1858-0054 Avago Technologies Us Inc Division semiconductor devices unitized Avl RFQ 1858-0054 Hewlett Packard Co semiconductor devices unitized Avl RFQ 37-0267 Leviton Manufacturing Co Inc semiconductor devices unitized Avl RFQ 50213100 Magnetic Peripherals Inc Normand semiconductor devices unitized Avl RFQ 90974 Intersil Corporation semiconductor devices unitized Avl RFQ CA3096E Rca Corp semiconductor devices unitized Avl RFQ CA3096E Intersil Corporation semiconductor devices unitized Avl RFQ
Characteristics Data of NSN 5961011494743MRC Criteria Characteristic ABBH INCLOSURE MATERIAL CERAMIC ABHP OVERALL LENGTH 0.785 INCHES MAXIMUM ABJT TERMINAL LENGTH 0.120 INCHES MAXIMUM ABKW OVERALL HEIGHT 0.280 INCHES MAXIMUM ABMK OVERALL WIDTH 0.300 INCHES MAXIMUM AKPV MOUNTING FACILITY QUANTITY 14 ASKA COMPONENT NAME AND QUANTITY 4 SEMICONDUCTOR DEVICE DIODE AXGY MOUNTING METHOD TERMINAL CTMZ SEMICONDUCTOR MATERIAL SILICON ALL SEMICONDUCTOR CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 60.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN ALL SEMICONDUCTOR AND 40.0 MAXIMUM WORKING PEAK OFF-STATE VOLTAGE ALL SEMICONDUCTOR CTQX CURRENT RATING PER CHARACTERISTIC 0.50 MILLIAMPERES SOURCE CUTOFF CURRENT MAXIMUM OF STANDARD RANGE ALL SEMICONDUCTOR CTRD POWER RATING PER CHARACTERISTIC 1900.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-EMITTER ABSOLUTE ALL SEMICONDUCTOR CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT -65.0 DEG CELSIUS CASE AND 175.0 DEG CELSIUS CASE TTQY TERMINAL TYPE AND QUANTITY 14 UNINSULATED WIRE LEAD
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | CERAMIC |
ABHP | OVERALL LENGTH | 0.785 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 0.120 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.280 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 0.300 INCHES MAXIMUM |
AKPV | MOUNTING FACILITY QUANTITY | 14 |
ASKA | COMPONENT NAME AND QUANTITY | 4 SEMICONDUCTOR DEVICE DIODE |
AXGY | MOUNTING METHOD | TERMINAL |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 60.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN ALL SEMICONDUCTOR AND 40.0 MAXIMUM WORKING PEAK OFF-STATE VOLTAGE ALL SEMICONDUCTOR |
CTQX | CURRENT RATING PER CHARACTERISTIC | 0.50 MILLIAMPERES SOURCE CUTOFF CURRENT MAXIMUM OF STANDARD RANGE ALL SEMICONDUCTOR |
CTRD | POWER RATING PER CHARACTERISTIC | 1900.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-EMITTER ABSOLUTE ALL SEMICONDUCTOR |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | -65.0 DEG CELSIUS CASE AND 175.0 DEG CELSIUS CASE |
TTQY | TERMINAL TYPE AND QUANTITY | 14 UNINSULATED WIRE LEAD |