NSN 5961-01-188-6042 of Semiconductor Device Diode - Parts Details
| Alternative NSN: 5961011886042 |
| Item Name: Semiconductor Device Diode |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 011886042 |
| NCB Code: USA (01) |
| Manufacturers: Micro Uspd Inc , Microsemi Corporation , Epcos Ag , Epcos Ag Abt Pr Roe K Pm , Philips Circuit Assemblies , Hudson H D Mfg Co , Kearfott Corp , Thales Avionics , Thales Communications Inc , Tdk Lambda Americas Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UES1106HR201, UES1106, Q68000-A5244-F25, MB7741, BYV26B under NSN 5961-01-188-6042 of Semiconductor Device Diode manufactured by Micro Uspd Inc, Microsemi Corporation, Epcos Ag, Epcos Ag Abt Pr Roe K Pm, Philips Circuit Assemblies.
Federal Supply Class of NSN 5961-01-188-6042 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-01-188-6042, 5961011886042
-
Part No Manufacturer Item Name QTY RFQ UES1106HR201 Micro Uspd Inc semiconductor device diode Avl RFQ UES1106 Microsemi Corporation semiconductor device diode Avl RFQ UES1106 Micro Uspd Inc semiconductor device diode Avl RFQ Q68000-A5244-F25 Epcos Ag semiconductor device diode Avl RFQ Q68000-A5244-F25 Epcos Ag Abt Pr Roe K Pm semiconductor device diode Avl RFQ MB7741 Micro Uspd Inc semiconductor device diode Avl RFQ BYV26B Philips Circuit Assemblies semiconductor device diode Avl RFQ BYV26B Hudson H D Mfg Co semiconductor device diode Avl RFQ A531A193-101 Kearfott Corp semiconductor device diode Avl RFQ 91590424 Thales Avionics semiconductor device diode Avl RFQ 30307447U Thales Communications Inc semiconductor device diode Avl RFQ 117606-002 Tdk Lambda Americas Inc semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961011886042MRC Criteria Characteristic ABBH INCLOSURE MATERIAL GLASS ABHP OVERALL LENGTH 0.250 INCHES MAXIMUM ABJT TERMINAL LENGTH 0.700 INCHES MINIMUM ADAV OVERALL DIAMETER 0.085 INCHES MAXIMUM AXGY MOUNTING METHOD TERMINAL CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE CTMZ SEMICONDUCTOR MATERIAL SILICON CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 400.0 MAXIMUM REVERSE VOLTAGE, PEAK CTQX CURRENT RATING PER CHARACTERISTIC 20.00 AMPERES SOURCE CUTOFF CURRENT HORSEPOWER METRIC CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS AMBIENT AIR TTQY TERMINAL TYPE AND QUANTITY 2 UNINSULATED WIRE LEAD
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.250 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 0.700 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.085 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 400.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 20.00 AMPERES SOURCE CUTOFF CURRENT HORSEPOWER METRIC |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |