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NSN 5961-01-374-7150 of Semiconductor Device Diode - Parts Details

Alternative NSN: 5961013747150
Item Name: Semiconductor Device Diode
FSG: 59 Electrical and Electronic Equipment Components
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware
NIIN: 013747150
NCB Code: USA (01)
Manufacturers: Philips Semiconductors Inc , Thales Communications Inc

ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers BBY40TRL, SS-29029 under NSN 5961-01-374-7150 of Semiconductor Device Diode manufactured by Philips Semiconductors Inc, Thales Communications Inc.

Federal Supply Class of NSN 5961-01-374-7150 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.

Part Number's List for NSN 5961-01-374-7150, 5961013747150

  • Part No Manufacturer Item Name QTY RFQ
    BBY40TRL Philips Semiconductors Inc semiconductor device diode Avl
    RFQ
    SS-29029 Thales Communications Inc semiconductor device diode Avl
    RFQ

Characteristics Data of NSN 5961013747150

MRCCriteriaCharacteristic
CTQNVoltage Rating In Volts Per Characteristic28.0 MAXIMUM EMITTER TO COLLECTOR VOLTAGE, FLOATING POTENTIAL, DC WITH BASE BIASED IN REVERSE DIRECTION WITH RESPECT TO THE COLLECTOR
AXGYMounting MethodTERMINAL
MRCDecoded RequirementClear Text Reply
CTRGCapacitance Rating In Picofarads3.8 MINIMUM AND 4.8 MAXIMUM
ABHPOverall Length2.8 MILLIMETERS MINIMUM AND 3.0 MILLIMETERS MAXIMUM
CTSGMaximum Operating Temp Per Measurement Point85.0 DEG CELSIUS JUNCTION
TTQYTerminal Type And Quantity2 UNINSULATED WIRE LEAD
ABMKOverall Width1.2 MILLIMETERS MINIMUM AND 1.4 MILLIMETERS MAXIMUM
CTQXCurrent Rating Per Characteristic10.00 NANOAMPERES MINIMUM OPERATING VOLTAGE DC PEAK
ABKWOverall Height1.1 MILLIMETERS MAXIMUM
ALAZJoint Electronic Device Engineering Council/Jedec/Case Outline DesignationTO-23
FEATSpecial FeaturesTHIRD LEAD NOT CONNECTED; JUNCTION PATTERN ARRANGEMENT: PN
ABBHInclosure MaterialPLASTIC
CTMZSemiconductor MaterialSILICON

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