NSN 5961-01-374-7151 of Semiconductor Device Diode - Parts Details
Alternative NSN: 5961013747151 |
Item Name: Semiconductor Device Diode |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 013747151 |
NCB Code: USA (01) |
Manufacturers: Bc Components , Philips Semiconductors Inc , Thales Communications Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers BAT18, BAT18TRL, SS-35612 under NSN 5961-01-374-7151 of Semiconductor Device Diode manufactured by Bc Components, Philips Semiconductors Inc, Thales Communications Inc.
Federal Supply Class of NSN 5961-01-374-7151 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-01-374-7151, 5961013747151
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Part No Manufacturer Item Name QTY RFQ BAT18 Bc Components semiconductor device diode Avl RFQ BAT18 Philips Semiconductors Inc semiconductor device diode Avl RFQ BAT18TRL Philips Semiconductors Inc semiconductor device diode Avl RFQ SS-35612 Thales Communications Inc semiconductor device diode Avl RFQ
Characteristics Data of NSN 5961013747151MRC Criteria Characteristic CTQN Voltage Rating In Volts Per Characteristic 35.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS AXGY Mounting Method TERMINAL MRC Decoded Requirement Clear Text Reply ABHP Overall Length 2.8 MILLIMETERS MINIMUM AND 3.0 MILLIMETERS MAXIMUM CTSG Maximum Operating Temp Per Measurement Point 125.0 DEG CELSIUS JUNCTION ABMK Overall Width 1.2 MILLIMETERS MINIMUM AND 1.4 MILLIMETERS MAXIMUM CTQX Current Rating Per Characteristic 100.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET TTQY Terminal Type And Quantity 2 UNINSULATED WIRE LEAD ABKW Overall Height 1.1 MILLIMETERS MAXIMUM ALAZ Joint Electronic Device Engineering Council/Jedec/Case Outline Designation SOT-23 ABBH Inclosure Material PLASTIC CTMZ Semiconductor Material SILICON
MRC | Criteria | Characteristic |
---|---|---|
CTQN | Voltage Rating In Volts Per Characteristic | 35.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
AXGY | Mounting Method | TERMINAL |
MRC | Decoded Requirement | Clear Text Reply |
ABHP | Overall Length | 2.8 MILLIMETERS MINIMUM AND 3.0 MILLIMETERS MAXIMUM |
CTSG | Maximum Operating Temp Per Measurement Point | 125.0 DEG CELSIUS JUNCTION |
ABMK | Overall Width | 1.2 MILLIMETERS MINIMUM AND 1.4 MILLIMETERS MAXIMUM |
CTQX | Current Rating Per Characteristic | 100.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET |
TTQY | Terminal Type And Quantity | 2 UNINSULATED WIRE LEAD |
ABKW | Overall Height | 1.1 MILLIMETERS MAXIMUM |
ALAZ | Joint Electronic Device Engineering Council/Jedec/Case Outline Designation | SOT-23 |
ABBH | Inclosure Material | PLASTIC |
CTMZ | Semiconductor Material | SILICON |