NSN 5961-01-383-7417 of Semiconductor Device Assembly - Parts Details
| Alternative NSN: 5961013837417 |
| Item Name: Semiconductor Device Assembly |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 013837417 |
| NCB Code: USA (01) |
| Manufacturers: Wellman Thermal Systems Corp , Wyvern Technologies Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 6-60901-501 under NSN 5961-01-383-7417 of Semiconductor Device Assembly manufactured by Wellman Thermal Systems Corp, Wyvern Technologies Inc.
Federal Supply Class of NSN 5961-01-383-7417 is FSC 5961 contains part details of Semiconductor Devices and Associated Hardware. Quote for your desired part numbers.
Part Number's List for NSN 5961-01-383-7417, 5961013837417
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Part No Manufacturer Item Name QTY RFQ 6-60901-501 Wellman Thermal Systems Corp semiconductor device assembly Avl RFQ 6-60901-501 Wyvern Technologies Inc semiconductor device assembly Avl RFQ
Characteristics Data of NSN 5961013837417MRC Criteria Characteristic ABHP OVERALL LENGTH 5.000 INCHES NOMINAL ABKW OVERALL HEIGHT 1.500 INCHES NOMINAL ABMK OVERALL WIDTH 4.250 INCHES NOMINAL AEAS MAJOR COMPONENTS DIODE 3 AGAV END ITEM IDENTIFICATION F-5 AIRCRAFT ALGC MOUNTING CONFIGURATION 4X UNTH MTG HOLES
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 5.000 INCHES NOMINAL |
| ABKW | OVERALL HEIGHT | 1.500 INCHES NOMINAL |
| ABMK | OVERALL WIDTH | 4.250 INCHES NOMINAL |
| AEAS | MAJOR COMPONENTS | DIODE 3 |
| AGAV | END ITEM IDENTIFICATION | F-5 AIRCRAFT |
| ALGC | MOUNTING CONFIGURATION | 4X UNTH MTG HOLES |