NSN 5962-00-007-3648 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962000073648 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 000073648 |
| NCB Code: USA (00) |
| Manufacturers: Microsemi Corporation , Drs Sustainment Systems Inc Division , Telcom Semiconductor Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SG741T, ES3203-04, 741BE under NSN 5962-00-007-3648 of Microcircuit Linear manufactured by Microsemi Corporation, Drs Sustainment Systems Inc Division, Telcom Semiconductor Inc.
Federal Supply Class of NSN 5962-00-007-3648 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-007-3648, 5962000073648
Characteristics Data of NSN 5962000073648MRC Criteria Characteristic ABKW OVERALL HEIGHT 0.685 INCHES NOMINAL ADAR BODY OUTSIDE DIAMETER 0.370 INCHES MAXIMUM ADAU BODY HEIGHT 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND MONOLITHIC CQSJ INCLOSURE MATERIAL METAL CQSZ INCLOSURE CONFIGURATION CAN CQZP INPUT CIRCUIT PATTERN 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE CTFT CASE OUTLINE SOURCE AND DESIGNATOR TO-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | OVERALL HEIGHT | 0.685 INCHES NOMINAL |
| ADAR | BODY OUTSIDE DIAMETER | 0.370 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/RESISTOR AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | TO-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |