NSN 5962-00-007-4071 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962000074071 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 000074071 |
| NCB Code: USA (00) |
| Manufacturers: Texas Instrument Inc , National Semiconductor Corp , Fairchild Semiconductor Corp , Advanced Micro Devices Inc , Telcom Semiconductor Inc , Solitron Devices Inc , Raytheon Aircraft |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN16269, SL8546, SL22147, LS1319, LM101BE004 under NSN 5962-00-007-4071 of Microcircuit Linear manufactured by Texas Instrument Inc, National Semiconductor Corp, Fairchild Semiconductor Corp, Advanced Micro Devices Inc, Telcom Semiconductor Inc.
Federal Supply Class of NSN 5962-00-007-4071 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-007-4071, 5962000074071
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Part No Manufacturer Item Name QTY RFQ SN16269 Texas Instrument Inc microcircuit linear Avl RFQ SL8546 National Semiconductor Corp microcircuit linear Avl RFQ SL22147 Fairchild Semiconductor Corp microcircuit linear Avl RFQ LS1319 Advanced Micro Devices Inc microcircuit linear Avl RFQ LM101BE004 Telcom Semiconductor Inc microcircuit linear Avl RFQ I1078 Solitron Devices Inc microcircuit linear Avl RFQ 710200-24 Raytheon Aircraft microcircuit linear Avl RFQ
Characteristics Data of NSN 5962000074071MRC Criteria Characteristic ADAR BODY OUTSIDE DIAMETER 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND MEDIUM SPEED AND HIGH GAIN AND EXTERNALLY COMPENSATED CQSJ INCLOSURE MATERIAL GLASS AND METAL CQSZ INCLOSURE CONFIGURATION CAN CQZP INPUT CIRCUIT PATTERN 5 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 AMPLIFIER, DIFFERENTIAL CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT TIN CZEQ TIME RATING PER CHACTERISTIC 100.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 05869-710200-24 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND MEDIUM SPEED AND HIGH GAIN AND EXTERNALLY COMPENSATED |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQZP | INPUT CIRCUIT PATTERN | 5 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, DIFFERENTIAL |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| CZEQ | TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 05869-710200-24 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |