NSN 5962-00-007-7803 of Microcircuit Digital - Parts Details
Alternative NSN: 5962000077803 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 000077803 |
NCB Code: USA (00) |
Manufacturers: Texas Instrument Inc , Siliconix Incorporated Div Silic , Freescale Semiconductor Inc , Fairchild Semiconductor Corp , Raytheon Aircraft |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN19956, SI329465, SC10914LH2, MC946L, HL15843 under NSN 5962-00-007-7803 of Microcircuit Digital manufactured by Texas Instrument Inc, Siliconix Incorporated Div Silic, Freescale Semiconductor Inc, Fairchild Semiconductor Corp, Raytheon Aircraft.
Federal Supply Class of NSN 5962-00-007-7803 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-007-7803, 5962000077803
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Part No Manufacturer Item Name QTY RFQ SN19956 Texas Instrument Inc microcircuit digital Avl RFQ SI329465 Siliconix Incorporated Div Silic microcircuit digital Avl RFQ SC10914LH2 Freescale Semiconductor Inc microcircuit digital Avl RFQ MC946L Freescale Semiconductor Inc microcircuit digital Avl RFQ HL15843 Fairchild Semiconductor Corp microcircuit digital Avl RFQ HL15842 Fairchild Semiconductor Corp microcircuit digital Avl RFQ 946DM Fairchild Semiconductor Corp microcircuit digital Avl RFQ 932219-1B Raytheon Aircraft microcircuit digital Avl RFQ
Characteristics Data of NSN 5962000077803MRC Criteria Characteristic ADAQ BODY LENGTH 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 65.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND MEDIUM SPEED CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM DIODE-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, NAND-NOR CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL TEST TEST DATA DOCUMENT 82577-932219 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 65.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND MEDIUM SPEED |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND-NOR |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
TEST | TEST DATA DOCUMENT | 82577-932219 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |