NSN 5962-00-251-1378 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962002511378 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 002511378 |
| NCB Code: USA (00) |
| Manufacturers: Nautel Limited , National Semiconductor Corp , Adelco Elektronik Gmbh , Intersil Corporation , Lacon Electronic Gmbh , Tadiran Ltd , L 3 Communications |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UA02, CD4011MJ, CD4011ADA, CD4011AD, 5921073 under NSN 5962-00-251-1378 of Microcircuit Digital manufactured by Nautel Limited, National Semiconductor Corp, Adelco Elektronik Gmbh, Intersil Corporation, Lacon Electronic Gmbh.
Federal Supply Class of NSN 5962-00-251-1378 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-251-1378, 5962002511378
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Part No Manufacturer Item Name QTY RFQ UA02 Nautel Limited microcircuit digital Avl RFQ CD4011MJ National Semiconductor Corp microcircuit digital Avl RFQ CD4011ADA Adelco Elektronik Gmbh microcircuit digital Avl RFQ CD4011AD Intersil Corporation microcircuit digital Avl RFQ CD4011AD Lacon Electronic Gmbh microcircuit digital Avl RFQ CD4011AD Adelco Elektronik Gmbh microcircuit digital Avl RFQ 5921073 Tadiran Ltd microcircuit digital Avl RFQ 046-97-00195 L 3 Communications microcircuit digital Avl RFQ
Characteristics Data of NSN 5962002511378MRC Criteria Characteristic ADAQ BODY LENGTH 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM ADAU BODY HEIGHT 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, NAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR -0-001-AD JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 15.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AD JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 15.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |