NSN 5962-00-420-5484 of Microcircuit Digital - Parts Details
Alternative NSN: 5962004205484 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 004205484 |
NCB Code: USA (00) |
Manufacturers: Texas Instrument Inc , Fairchild Semiconductor Corp , Powell Electronics Inc , Boeing Company |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers U3I994651X, 9946FM, 477-0216-001 under NSN 5962-00-420-5484 of Microcircuit Digital manufactured by Texas Instrument Inc, Fairchild Semiconductor Corp, Powell Electronics Inc, Boeing Company.
Federal Supply Class of NSN 5962-00-420-5484 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-420-5484, 5962004205484
-
Part No Manufacturer Item Name QTY RFQ U3I994651X Texas Instrument Inc microcircuit digital Avl RFQ U3I994651X Fairchild Semiconductor Corp microcircuit digital Avl RFQ 9946FM Powell Electronics Inc microcircuit digital Avl RFQ 477-0216-001 Boeing Company microcircuit digital Avl RFQ
Characteristics Data of NSN 5962004205484MRC Criteria Characteristic ADAQ BODY LENGTH 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM" ADAT BODY WIDTH 0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM" ADAU BODY HEIGHT 0.035 INCHES MINIMUM AND 0.070 INCHES MAXIMUM" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND BURN IN" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION FLAT PACK" CQWX OUTPUT LOGIC FORM DIODE-TRANSISTOR LOGIC" CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT" CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, NAND" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 8.0 VOLTS MAXIMUM POWER SOURCE" CZEQ TIME RATING PER CHACTERISTIC 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 14 FLAT LEADS" ADAQ BODY LENGTH 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM" ADAT BODY WIDTH 0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM" ADAU BODY HEIGHT 0.035 INCHES MINIMUM AND 0.070 INCHES MAXIMUM" AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS" AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS" CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND BURN IN" CQSJ INCLOSURE MATERIAL CERAMIC" CQSZ INCLOSURE CONFIGURATION FLAT PACK" CQWX OUTPUT LOGIC FORM DIODE-TRANSISTOR LOGIC" CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT" CSSL DESIGN FUNCTION AND QUANTITY 4 GATE, NAND" CWSG TERMINAL SURFACE TREATMENT SOLDER" CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 8.0 VOLTS MAXIMUM POWER SOURCE" CZEQ TIME RATING PER CHACTERISTIC 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." TTQY TERMINAL TYPE AND QUANTITY 14 FLAT LEADS"
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.035 INCHES MINIMUM AND 0.070 INCHES MAXIMUM" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND BURN IN" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT" |
CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 8.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS" |
ADAQ | BODY LENGTH | 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM" |
ADAT | BODY WIDTH | 0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM" |
ADAU | BODY HEIGHT | 0.035 INCHES MINIMUM AND 0.070 INCHES MAXIMUM" |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS" |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND BURN IN" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK" |
CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC" |
CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT" |
CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 8.0 VOLTS MAXIMUM POWER SOURCE" |
CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT" |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS" |