NSN 5962-00-454-2039 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962004542039 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 004542039 |
| NCB Code: USA (00) |
| Manufacturers: Philips Semiconductors Inc , Dla Land And Maritime , Tadiran Ltd |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers S8424W, S8424J, DMS 80015B, 5921006 under NSN 5962-00-454-2039 of Microcircuit Digital manufactured by Philips Semiconductors Inc, Dla Land And Maritime, Tadiran Ltd.
Federal Supply Class of NSN 5962-00-454-2039 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-454-2039, 5962004542039
Characteristics Data of NSN 5962004542039MRC Criteria Characteristic ADAQ BODY LENGTH 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM ADAT BODY WIDTH 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 49.4 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+200.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND ASYNCHRONOUS AND EDGE TRIGGERED AND LOW POWER AND MONOLITHIC AND POSITIVE OUTPUTS AND RESETTABLE AND SYNCHRONOUS AND W/CLEAR AND NEGATIVE EDGE TRIGGERED CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM EMITTER-COUPLED LOGIC CQZP INPUT CIRCUIT PATTERN DUAL 4 INPUT CSSL DESIGN FUNCTION AND QUANTITY 2 FLIP-FLOP, CLOCKED AND 2 FLIP-FLOP, R-S-T INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR -0-004-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 14 FLAT LEADS
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 49.4 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+200.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND ASYNCHRONOUS AND EDGE TRIGGERED AND LOW POWER AND MONOLITHIC AND POSITIVE OUTPUTS AND RESETTABLE AND SYNCHRONOUS AND W/CLEAR AND NEGATIVE EDGE TRIGGERED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | EMITTER-COUPLED LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, CLOCKED AND 2 FLIP-FLOP, R-S-T INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-004-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |