NSN 5962-00-460-5745 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962004605745 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 004605745 |
| NCB Code: USA (00) |
| Manufacturers: Fairchild Semiconductor Corp , Thales Air Systems Sa , Thales Vorm Thomsoncsf Elektronic , Canberra Industries Inc , Data Device Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 9309DC, 91299257, 35-0067, 100-48, 100-000048 under NSN 5962-00-460-5745 of Microcircuit Digital manufactured by Fairchild Semiconductor Corp, Thales Air Systems Sa, Thales Vorm Thomsoncsf Elektronic, Canberra Industries Inc, Data Device Corporation.
Federal Supply Class of NSN 5962-00-460-5745 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-460-5745, 5962004605745
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Part No Manufacturer Item Name QTY RFQ 9309DC Fairchild Semiconductor Corp microcircuit digital Avl RFQ 91299257 Thales Air Systems Sa microcircuit digital Avl RFQ 91299257 Thales Vorm Thomsoncsf Elektronic microcircuit digital Avl RFQ 35-0067 Canberra Industries Inc microcircuit digital Avl RFQ 100-48 Data Device Corporation microcircuit digital Avl RFQ 100-000048 Data Device Corporation microcircuit digital Avl RFQ
Characteristics Data of NSN 5962004605745MRC Criteria Characteristic ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 150.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+75.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND COMPLEMENTARY OUTPUTS AND W/BUFFERED OUTPUT AND POSITIVE OUTPUTS AND HIGH SPEED CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CSSL DESIGN FUNCTION AND QUANTITY 2 MULTIPLEXER CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 36.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 36.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.271 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 150.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND COMPLEMENTARY OUTPUTS AND W/BUFFERED OUTPUT AND POSITIVE OUTPUTS AND HIGH SPEED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 MULTIPLEXER |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 36.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 36.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |