NSN 5962-00-497-7849 of Microcircuit Linear - Parts Details
Alternative NSN: 5962004977849 |
Item Name: Microcircuit Linear |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 004977849 |
NCB Code: USA (00) |
Manufacturers: Thales Nederland , Advanced Micro Devices Inc , Bastogi Sistemi Spa , Fairchild Semiconductor Corp , Thales Vorm Thomsoncsf Elektronic , Thales Air Systems Sa , Oerlikon Buehrle Ag Werkzeugmaschinenfabrik |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 352250021887, 39814392-1, 4-30483P, 715HM, 99072335 under NSN 5962-00-497-7849 of Microcircuit Linear manufactured by Thales Nederland, Advanced Micro Devices Inc, Bastogi Sistemi Spa, Fairchild Semiconductor Corp, Thales Vorm Thomsoncsf Elektronic.
Federal Supply Class of NSN 5962-00-497-7849 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-497-7849, 5962004977849
-
Part No Manufacturer Item Name QTY RFQ 352250021887 Thales Nederland microcircuit linear Avl RFQ 39814392-1 Advanced Micro Devices Inc microcircuit linear Avl RFQ 4-30483P Bastogi Sistemi Spa microcircuit linear Avl RFQ 715HM Fairchild Semiconductor Corp microcircuit linear Avl RFQ 99072335 Thales Vorm Thomsoncsf Elektronic microcircuit linear Avl RFQ 99072335 Thales Air Systems Sa microcircuit linear Avl RFQ U6W7715393 Advanced Micro Devices Inc microcircuit linear Avl RFQ W5075451CA Oerlikon Buehrle Ag Werkzeugmaschinenfabrik microcircuit linear Avl RFQ
Characteristics Data of NSN 5962004977849MRC Criteria Characteristic ADAR BODY OUTSIDE DIAMETER 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND HIGH GAIN AND EXTERNALLY COMPENSATED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL GLASS AND METAL CQSZ INCLOSURE CONFIGURATION CAN CQZP INPUT CIRCUIT PATTERN 7 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 AMPLIFIER, OPERATIONAL, HIGH SPEED CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEQ TIME RATING PER CHACTERISTIC 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT
MRC | Criteria | Characteristic |
---|---|---|
ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND HIGH GAIN AND EXTERNALLY COMPENSATED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
CQSZ | INCLOSURE CONFIGURATION | CAN |
CQZP | INPUT CIRCUIT PATTERN | 7 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, OPERATIONAL, HIGH SPEED |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEQ | TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |