NSN 5962-00-553-8784 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962005538784 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 005538784 |
| NCB Code: USA (00) |
| Manufacturers: National Semiconductor Corp , Intel Corp Sales Office , Advanced Micro Devices Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers MM1404AH883B, MM1404AH, M1404A, AM1404AHMB under NSN 5962-00-553-8784 of Microcircuit Digital manufactured by National Semiconductor Corp, Intel Corp Sales Office, Advanced Micro Devices Inc.
Federal Supply Class of NSN 5962-00-553-8784 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-553-8784, 5962005538784
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Part No Manufacturer Item Name QTY RFQ MM1404AH883B National Semiconductor Corp microcircuit digital Avl RFQ MM1404AH National Semiconductor Corp microcircuit digital Avl RFQ M1404A Intel Corp Sales Office microcircuit digital Avl RFQ AM1404AHMB Advanced Micro Devices Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962005538784MRC Criteria Characteristic ADAR BODY OUTSIDE DIAMETER 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 600.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+160.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND W/BUFFERED OUTPUT AND BIPOLAR AND LOW POWER CQSJ INCLOSURE MATERIAL GLASS AND METAL CQSZ INCLOSURE CONFIGURATION CAN CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 3 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 SHIFT REGISTER, DYNAMIC CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT GOLD CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 20.0 VOLTS MAXIMUM POWER SOURCE PMLC PRECIOUS MATERIAL AND LOCATION TERMINALS GOLD PRMT PRECIOUS MATERIAL GOLD TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 8 PIN
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 600.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+160.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND W/BUFFERED OUTPUT AND BIPOLAR AND LOW POWER |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 3 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 SHIFT REGISTER, DYNAMIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | GOLD |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.0 VOLTS MAXIMUM POWER SOURCE |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 8 PIN |