NSN 5962-00-824-4642 of Microcircuit Digital - Parts Details
Alternative NSN: 5962008244642 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 008244642 |
NCB Code: USA (00) |
Manufacturers: Alliant Techsystems Inc , Herley Industries Inc , Fairchild Semiconductor Corp , L 3 Communications , Itt Semiconductors Division , Freescale Semiconductor Inc , Philco Distributors Inc , Texas Instrument Inc , Stewartwarner Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 2603797-2, 9322, 932FC, G000370-932, M1C932-5B under NSN 5962-00-824-4642 of Microcircuit Digital manufactured by Alliant Techsystems Inc, Herley Industries Inc, Fairchild Semiconductor Corp, L 3 Communications, Itt Semiconductors Division.
Federal Supply Class of NSN 5962-00-824-4642 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-00-824-4642, 5962008244642
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Part No Manufacturer Item Name QTY RFQ 2603797-2 Alliant Techsystems Inc microcircuit digital Avl RFQ 9322 Herley Industries Inc microcircuit digital Avl RFQ 932FC Fairchild Semiconductor Corp microcircuit digital Avl RFQ G000370-932 L 3 Communications microcircuit digital Avl RFQ M1C932-5B Itt Semiconductors Division microcircuit digital Avl RFQ MC832F Freescale Semiconductor Inc microcircuit digital Avl RFQ MIC932-3 Itt Semiconductors Division microcircuit digital Avl RFQ PL993259 Philco Distributors Inc microcircuit digital Avl RFQ SN15832H Texas Instrument Inc microcircuit digital Avl RFQ SN15832U Texas Instrument Inc microcircuit digital Avl RFQ SW932-2F Stewartwarner Corporation microcircuit digital Avl RFQ U3I993259X Fairchild Semiconductor Corp microcircuit digital Avl RFQ
Characteristics Data of NSN 5962008244642MRC Criteria Characteristic ADAQ BODY LENGTH 0.275 INCHES MAXIMUM ADAT BODY WIDTH 0.275 INCHES MAXIMUM ADAU BODY HEIGHT 0.065 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 120.0 MILLIWATTS AFGA OPERATING TEMP RANGE -0.0/+75.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND W/EXPANDER CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM DIODE-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN DUAL 4 INPUT CSSL DESIGN FUNCTION AND QUANTITY 2 BUFFER, NAND CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL TTQY TERMINAL TYPE AND QUANTITY 14 FLAT LEADS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.275 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.275 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.065 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 120.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -0.0/+75.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND W/EXPANDER |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 BUFFER, NAND |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |