NSN 5962-01-013-2717 of Microcircuit Digital - Parts Details
Alternative NSN: 5962010132717 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 010132717 |
NCB Code: USA (01) |
Manufacturers: Bae Systems , Bae Systems Integrated System , Texas Instrument Inc , National Semiconductor Corp , Raytheon Aircraft , Fairchild Semiconductor Corp , Heathkit Co Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SS31126-101, SNC54126J-00, SNC54126J, DM54126J 883B, 772135-1 under NSN 5962-01-013-2717 of Microcircuit Digital manufactured by Bae Systems, Bae Systems Integrated System, Texas Instrument Inc, National Semiconductor Corp, Raytheon Aircraft.
Federal Supply Class of NSN 5962-01-013-2717 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-013-2717, 5962010132717
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Part No Manufacturer Item Name QTY RFQ SS31126-101 Bae Systems microcircuit digital Avl RFQ SS31126-101 Bae Systems Integrated System microcircuit digital Avl RFQ SNC54126J-00 Texas Instrument Inc microcircuit digital Avl RFQ SNC54126J Texas Instrument Inc microcircuit digital Avl RFQ DM54126J 883B National Semiconductor Corp microcircuit digital Avl RFQ 772135-1 Raytheon Aircraft microcircuit digital Avl RFQ 74126N Fairchild Semiconductor Corp microcircuit digital Avl RFQ 443-717 Heathkit Co Inc microcircuit digital Avl RFQ
Characteristics Data of NSN 5962010132717MRC Criteria Characteristic ADAQ BODY LENGTH 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 180.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/ENABLE AND W/DISABLE AND BIPOLAR AND W/BUFFERED OUTPUT AND EXPANDABLE AND 3-STATE OUTPUT AND W/TOTEM POLE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN QUAD 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 4 BUFFER, NONINVERTING AND 4 GATE, AND CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 180.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/ENABLE AND W/DISABLE AND BIPOLAR AND W/BUFFERED OUTPUT AND EXPANDABLE AND 3-STATE OUTPUT AND W/TOTEM POLE OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 4 BUFFER, NONINVERTING AND 4 GATE, AND |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |