NSN 5962-01-024-5223 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962010245223 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010245223 |
| NCB Code: USA (01) |
| Manufacturers: National Semiconductor Corp , Advanced Micro Devices Inc , Intersil Corporation , Sagem Telecommunications , Thales Systemes Aeroportes Sa |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers LM111F, HA9-2111-2, 971074-211, 14050429-2, 01401879 under NSN 5962-01-024-5223 of Microcircuit Linear manufactured by National Semiconductor Corp, Advanced Micro Devices Inc, Intersil Corporation, Sagem Telecommunications, Thales Systemes Aeroportes Sa.
Federal Supply Class of NSN 5962-01-024-5223 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-024-5223, 5962010245223
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Part No Manufacturer Item Name QTY RFQ LM111F National Semiconductor Corp microcircuit linear Avl RFQ LM111F Advanced Micro Devices Inc microcircuit linear Avl RFQ HA9-2111-2 Intersil Corporation microcircuit linear Avl RFQ 971074-211 Advanced Micro Devices Inc microcircuit linear Avl RFQ 971074-211 Intersil Corporation microcircuit linear Avl RFQ 971074-211 National Semiconductor Corp microcircuit linear Avl RFQ 14050429-2 Sagem Telecommunications microcircuit linear Avl RFQ 01401879 Thales Systemes Aeroportes Sa microcircuit linear Avl RFQ
Characteristics Data of NSN 5962010245223MRC Criteria Characteristic ADAQ BODY LENGTH 0.260 INCHES MAXIMUM ADAT BODY WIDTH 0.070 INCHES MAXIMUM ADAU BODY HEIGHT 0.260 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION CIRCUIT CARD ASSY P%N 779660 CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND INTERNALLY COMPENSATED AND POSITIVE OUTPUTS AND W/STROBE CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQZP INPUT CIRCUIT PATTERN 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 COMPARATOR, VOLTAGE, DIFFERENTIAL CWSG TERMINAL SURFACE TREATMENT TIN CZEQ TIME RATING PER CHACTERISTIC 200.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT TEST TEST DATA DOCUMENT 06481-971074 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.260 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.070 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.260 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | CIRCUIT CARD ASSY P%N 779660 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND INTERNALLY COMPENSATED AND POSITIVE OUTPUTS AND W/STROBE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 COMPARATOR, VOLTAGE, DIFFERENTIAL |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| CZEQ | TIME RATING PER CHACTERISTIC | 200.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 06481-971074 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |