NSN 5962-01-026-6045 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962010266045 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010266045 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Intersil Corporation , National Semiconductor Corp , Mmi Amd , Hewlett Packard Co , Agilent Technologies Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TBP18SA030N, IM5600CPE, DM74S188N, 6330-1J, 1816-0184 under NSN 5962-01-026-6045 of Microcircuit Memory manufactured by Texas Instrument Inc, Intersil Corporation, National Semiconductor Corp, Mmi Amd, Hewlett Packard Co.
Federal Supply Class of NSN 5962-01-026-6045 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-026-6045, 5962010266045
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Part No Manufacturer Item Name QTY RFQ TBP18SA030N Texas Instrument Inc microcircuit memory Avl RFQ IM5600CPE Intersil Corporation microcircuit memory Avl RFQ DM74S188N National Semiconductor Corp microcircuit memory Avl RFQ 6330-1J Mmi Amd microcircuit memory Avl RFQ 1816-0184 Hewlett Packard Co microcircuit memory Avl RFQ 1816-0184 Agilent Technologies Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010266045MRC Criteria Characteristic ADAQ BODY LENGTH 0.740 INCHES MINIMUM AND 0.870 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.120 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 625.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION TEST SET COUNTERMEASURE FSCM 94117 CBBL FEATURES PROVIDED BIPOLAR AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND W/DISABLE AND W/ENABLE CQSJ INCLOSURE MATERIAL PLASTIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 6 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.740 INCHES MINIMUM AND 0.870 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | TEST SET COUNTERMEASURE FSCM 94117 |
| CBBL | FEATURES PROVIDED | BIPOLAR AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND W/DISABLE AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | PLASTIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |