NSN 5962-01-027-9237 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962010279237 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010279237 |
| NCB Code: USA (01) |
| Manufacturers: Adelco Elektronik Gmbh , Lacon Electronic Gmbh , Freescale Semiconductor Inc , Bae Systems , Bae Systems Integrated System , Thales Vorm Thomsoncsf Elektronic , Thales Systemes Aeroportes Sa , Selex Communications Gmbh , Te Connectivity |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers MC14049UBCLA, MC14049UBCL, MC14049CL, CSS 349014-1, 91339226 under NSN 5962-01-027-9237 of Microcircuit Digital manufactured by Adelco Elektronik Gmbh, Lacon Electronic Gmbh, Freescale Semiconductor Inc, Bae Systems, Bae Systems Integrated System.
Federal Supply Class of NSN 5962-01-027-9237 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-027-9237, 5962010279237
-
Part No Manufacturer Item Name QTY RFQ MC14049UBCLA Adelco Elektronik Gmbh microcircuit digital Avl RFQ MC14049UBCL Lacon Electronic Gmbh microcircuit digital Avl RFQ MC14049UBCL Adelco Elektronik Gmbh microcircuit digital Avl RFQ MC14049UBCL Freescale Semiconductor Inc microcircuit digital Avl RFQ MC14049CL Freescale Semiconductor Inc microcircuit digital Avl RFQ CSS 349014-1 Bae Systems microcircuit digital Avl RFQ CSS 349014-1 Bae Systems Integrated System microcircuit digital Avl RFQ 91339226 Thales Vorm Thomsoncsf Elektronic microcircuit digital Avl RFQ 91339226 Thales Systemes Aeroportes Sa microcircuit digital Avl RFQ 6L.5442.325.00-151703 Selex Communications Gmbh microcircuit digital Avl RFQ 002 4161 113663 Te Connectivity microcircuit digital Avl RFQ
Characteristics Data of NSN 5962010279237MRC Criteria Characteristic ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM ADAU BODY HEIGHT 0.160 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 830.0 MILLIWATTS AFGA OPERATING TEMP RANGE -40.0/+85.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND LOW POWER AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND COMPLEMENTARY OUTPUTS AND TEMPERATURE CONTROLLED CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN HEX 1 INPUT CSSL DESIGN FUNCTION AND QUANTITY 6 BUFFER, INVERTING
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.160 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 830.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND LOW POWER AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND COMPLEMENTARY OUTPUTS AND TEMPERATURE CONTROLLED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 6 BUFFER, INVERTING |