NSN 5962-01-030-9507 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962010309507 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010309507 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Wavetek U S Inc Div Of Wavetek Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SNC54188AJ00, SN74188N, SN74188AN, SN54188AJ-00, SN54188AJ under NSN 5962-01-030-9507 of Microcircuit Memory manufactured by Texas Instrument Inc, Wavetek U S Inc Div Of Wavetek Corp.
Federal Supply Class of NSN 5962-01-030-9507 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-030-9507, 5962010309507
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Part No Manufacturer Item Name QTY RFQ SNC54188AJ00 Texas Instrument Inc microcircuit memory Avl RFQ SN74188N Texas Instrument Inc microcircuit memory Avl RFQ SN74188AN Texas Instrument Inc microcircuit memory Avl RFQ SN54188AJ-00 Texas Instrument Inc microcircuit memory Avl RFQ SN54188AJ Texas Instrument Inc microcircuit memory Avl RFQ 8007-41-8800 Wavetek U S Inc Div Of Wavetek Corp microcircuit memory Avl RFQ 74188 Texas Instrument Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010309507MRC Criteria Characteristic ADAQ BODY LENGTH 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION DIGITAL DATA SET TYPE AN/FSQ-111 FSCM 81995 CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND W/ENABLE AND PROGRAMMABLE AND W/OPEN COLLECTOR AND EXPANDABLE AND W/BUFFERED OUTPUT AND POSITIVE OUTPUTS AND W/DECODED OUTPUT AND W/DISABLE CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 6 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | DIGITAL DATA SET TYPE AN/FSQ-111 FSCM 81995 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND W/ENABLE AND PROGRAMMABLE AND W/OPEN COLLECTOR AND EXPANDABLE AND W/BUFFERED OUTPUT AND POSITIVE OUTPUTS AND W/DECODED OUTPUT AND W/DISABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |