NSN 5962-01-033-5029 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962010335029 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010335029 |
| NCB Code: USA (01) |
| Manufacturers: Epcos Ag , Epcos Ag Abt Pr Roe K Pm , Intersil Corporation , Siliconix Incorporated Div Silic , Thales Avionics , Sagem Telecommunications |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers Q67100-A1447-Z, HI1-508A-2, HI1-0508A-2, DG508AAK, A1229886 under NSN 5962-01-033-5029 of Microcircuit Linear manufactured by Epcos Ag, Epcos Ag Abt Pr Roe K Pm, Intersil Corporation, Siliconix Incorporated Div Silic, Thales Avionics.
Federal Supply Class of NSN 5962-01-033-5029 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-033-5029, 5962010335029
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Part No Manufacturer Item Name QTY RFQ Q67100-A1447-Z Epcos Ag microcircuit linear Avl RFQ Q67100-A1447-Z Epcos Ag Abt Pr Roe K Pm microcircuit linear Avl RFQ HI1-508A-2 Intersil Corporation microcircuit linear Avl RFQ HI1-0508A-2 Intersil Corporation microcircuit linear Avl RFQ DG508AAK Siliconix Incorporated Div Silic microcircuit linear Avl RFQ A1229886 Thales Avionics microcircuit linear Avl RFQ 99124422 Thales Avionics microcircuit linear Avl RFQ 14058649-7 Sagem Telecommunications microcircuit linear Avl RFQ
Characteristics Data of NSN 5962010335029MRC Criteria Characteristic ADAQ BODY LENGTH 0.753 INCHES MINIMUM AND 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.265 INCHES MINIMUM AND 0.285 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.170 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 1.09 WATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND HIGH RELIABILITY AND FAST SETTLING CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQZP INPUT CIRCUIT PATTERN 8 CHANNEL CSSL DESIGN FUNCTION AND QUANTITY 1 MULTIPLEXER, ANALOG CWSG TERMINAL SURFACE TREATMENT TIN CZEQ TIME RATING PER CHACTERISTIC 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.753 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.09 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH RELIABILITY AND FAST SETTLING |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 8 CHANNEL |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 MULTIPLEXER, ANALOG |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| CZEQ | TIME RATING PER CHACTERISTIC | 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |