NSN 5962-01-045-1301 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962010451301 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010451301 |
| NCB Code: USA (01) |
| Manufacturers: Fairchild Semiconductor Corp , Drs Sustainment Systems Inc Division , Selex Communications Gmbh |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers UA747HMQB, ES3203-11, 747HMQB, 6L.5443.154-747 883B under NSN 5962-01-045-1301 of Microcircuit Linear manufactured by Fairchild Semiconductor Corp, Drs Sustainment Systems Inc Division, Selex Communications Gmbh.
Federal Supply Class of NSN 5962-01-045-1301 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-045-1301, 5962010451301
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Part No Manufacturer Item Name QTY RFQ UA747HMQB Fairchild Semiconductor Corp microcircuit linear Avl RFQ ES3203-11 Drs Sustainment Systems Inc Division microcircuit linear Avl RFQ 747HMQB Fairchild Semiconductor Corp microcircuit linear Avl RFQ 6L.5443.154-747 883B Selex Communications Gmbh microcircuit linear Avl RFQ
Characteristics Data of NSN 5962010451301MRC Criteria Characteristic ADAR BODY OUTSIDE DIAMETER 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND HIGH GAIN CQSJ INCLOSURE MATERIAL METAL CQSZ INCLOSURE CONFIGURATION CAN CQZP INPUT CIRCUIT PATTERN DUAL 2 INPUT CSSL DESIGN FUNCTION AND QUANTITY 2 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT TIN
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND HIGH GAIN |
| CQSJ | INCLOSURE MATERIAL | METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQZP | INPUT CIRCUIT PATTERN | DUAL 2 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |