NSN 5962-01-045-7924 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962010457924 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010457924 |
| NCB Code: USA (01) |
| Manufacturers: Drs Sustainment Systems Inc Division |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ES3363-03 under NSN 5962-01-045-7924 of Microcircuit Linear manufactured by Drs Sustainment Systems Inc Division.
Federal Supply Class of NSN 5962-01-045-7924 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-045-7924, 5962010457924
Characteristics Data of NSN 5962010457924MRC Criteria Characteristic ADAR Body Outside Diameter 0.335 INCHES MINIMUM AND ABKW Overall Height 0.685 INCHES NOMINAL AFGA Operating Temp Range -55.0 TO 125.0 DEG CELSIUS CBBL Features Provided BURN IN AND CSSL Design Function And Quantity 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE CQZP Input Circuit Pattern 2 INPUT CQSJ Inclosure Material METAL CWSG Terminal Surface Treatment SOLDER CBBL Features Provided LOW NOISE AND CBBL Features Provided MONOLITHIC MRC Decoded Requirement Clear Text Reply CBBL Features Provided HERMETICALLY SEALED AND ADAU Body Height 0.165 INCHES MINIMUM AND AEHX Maximum Power Dissipation Rating 300.0 MILLIWATTS CTFT Case Outline Source And Designator TO-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL ADAR Body Outside Diameter 0.370 INCHES MAXIMUM CQSZ Inclosure Configuration CAN AFJQ Storage Temp Range -65.0 TO 150.0 DEG CELSIUS ADAU Body Height 0.185 INCHES MAXIMUM
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAR | Body Outside Diameter | 0.335 INCHES MINIMUM AND |
| ABKW | Overall Height | 0.685 INCHES NOMINAL |
| AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
| CBBL | Features Provided | BURN IN AND |
| CSSL | Design Function And Quantity | 1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| CQZP | Input Circuit Pattern | 2 INPUT |
| CQSJ | Inclosure Material | METAL |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | LOW NOISE AND |
| CBBL | Features Provided | MONOLITHIC |
| MRC | Decoded Requirement | Clear Text Reply |
| CBBL | Features Provided | HERMETICALLY SEALED AND |
| ADAU | Body Height | 0.165 INCHES MINIMUM AND |
| AEHX | Maximum Power Dissipation Rating | 300.0 MILLIWATTS |
| CTFT | Case Outline Source And Designator | TO-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| ADAR | Body Outside Diameter | 0.370 INCHES MAXIMUM |
| CQSZ | Inclosure Configuration | CAN |
| AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
| ADAU | Body Height | 0.185 INCHES MAXIMUM |