NSN 5962-01-050-7806 of Microcircuit Memory - Parts Details
Alternative NSN: 5962010507806 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 010507806 |
NCB Code: USA (01) |
Manufacturers: Texas Instrument Inc , Dla Land And Maritime , Mmi Amd , Intersil Corporation , Intel Corp Sales Office , Bae Systems |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN74187J, ROM PROM FAMILY 021, MM6200-1J, IM5603CDE, HPROM1-1024A-5 under NSN 5962-01-050-7806 of Microcircuit Memory manufactured by Texas Instrument Inc, Dla Land And Maritime, Mmi Amd, Intersil Corporation, Intel Corp Sales Office.
Federal Supply Class of NSN 5962-01-050-7806 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-050-7806, 5962010507806
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Part No Manufacturer Item Name QTY RFQ SN74187J Texas Instrument Inc microcircuit memory Avl RFQ ROM PROM FAMILY 021 Dla Land And Maritime microcircuit memory Avl RFQ MM6200-1J Mmi Amd microcircuit memory Avl RFQ IM5603CDE Intersil Corporation microcircuit memory Avl RFQ HPROM1-1024A-5 Intersil Corporation microcircuit memory Avl RFQ HM1-7610-8 Intersil Corporation microcircuit memory Avl RFQ C3301A Intel Corp Sales Office microcircuit memory Avl RFQ 7013655P019 Intersil Corporation microcircuit memory Avl RFQ 7013655P019 Mmi Amd microcircuit memory Avl RFQ 7013655P019 Texas Instrument Inc microcircuit memory Avl RFQ 7013655P019 Bae Systems microcircuit memory Avl RFQ 7013655P019 Intel Corp Sales Office microcircuit memory Avl RFQ 7013655O019 Intersil Corporation microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010507806MRC Criteria Characteristic ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 657.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+75.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND HIGH SPEED AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND W/OPEN COLLECTOR AND BIPOLAR AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND W/DISABLE AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE PROM CZZZ MEMORY CAPACITY UNKNOWN TEST TEST DATA DOCUMENT 94117-7013655 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 657.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND HIGH SPEED AND PROGRAMMABLE AND PROGRAMMED AND SCHOTTKY AND W/OPEN COLLECTOR AND BIPOLAR AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND W/DISABLE AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | PROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 94117-7013655 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |