NSN 5962-01-052-9494 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962010529494 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010529494 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Philips Semiconductors Inc , Intersil Corporation , Compaq Federal Llc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ROM PROM FAMILY 022, N8223F, IM5600ACDE, A-PS-23A02A1-0-0, 23A02A1-04 under NSN 5962-01-052-9494 of Microcircuit Memory manufactured by Dla Land And Maritime, Philips Semiconductors Inc, Intersil Corporation, Compaq Federal Llc.
Federal Supply Class of NSN 5962-01-052-9494 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-052-9494, 5962010529494
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Part No Manufacturer Item Name QTY RFQ ROM PROM FAMILY 022 Dla Land And Maritime microcircuit memory Avl RFQ N8223F Philips Semiconductors Inc microcircuit memory Avl RFQ IM5600ACDE Intersil Corporation microcircuit memory Avl RFQ A-PS-23A02A1-0-0 Compaq Federal Llc microcircuit memory Avl RFQ 23A02A1-04 Philips Semiconductors Inc microcircuit memory Avl RFQ 23A02A1-03 Intersil Corporation microcircuit memory Avl RFQ 23A02A1 Compaq Federal Llc microcircuit memory Avl RFQ 23-A02A1-00 Compaq Federal Llc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010529494MRC Criteria Characteristic ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM ADAU BODY HEIGHT 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 625.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0/+75.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS AGAV END ITEM IDENTIFICATION COMPUTER,DIGITAL TYPE PDP11-10AC CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BIPOLAR AND HIGH SPEED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/DISABLE AND W/ENABLE AND W/STORAGE AND W/OPEN COLLECTOR CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 6 INPUT CTFT CASE OUTLINE SOURCE AND DESIGNATOR -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TEST TEST DATA DOCUMENT 15476-23A02A1 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.120 INCHES MINIMUM AND 0.195 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | COMPUTER,DIGITAL TYPE PDP11-10AC |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BIPOLAR AND HIGH SPEED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/DISABLE AND W/ENABLE AND W/STORAGE AND W/OPEN COLLECTOR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 15476-23A02A1 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |