NSN 5962-01-055-1872 of Microcircuit Linear - Parts Details
| Alternative NSN: 5962010551872 |
| Item Name: Microcircuit Linear |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010551872 |
| NCB Code: USA (01) |
| Manufacturers: Gould Inc Simulation Systems Division , Siliconix Incorporated Div Silic , Intersil Corporation , Analog Devices Inc , Hewlett Packard Co |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ES52SPL-DG200, DG200ABA, DG200AAA 883, DG200AA883B, DG200AA-2 under NSN 5962-01-055-1872 of Microcircuit Linear manufactured by Gould Inc Simulation Systems Division, Siliconix Incorporated Div Silic, Intersil Corporation, Analog Devices Inc, Hewlett Packard Co.
Federal Supply Class of NSN 5962-01-055-1872 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-055-1872, 5962010551872
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Part No Manufacturer Item Name QTY RFQ ES52SPL-DG200 Gould Inc Simulation Systems Division microcircuit linear Avl RFQ DG200ABA Siliconix Incorporated Div Silic microcircuit linear Avl RFQ DG200AAA 883 Siliconix Incorporated Div Silic microcircuit linear Avl RFQ DG200AA883B Intersil Corporation microcircuit linear Avl RFQ DG200AA-2 Siliconix Incorporated Div Silic microcircuit linear Avl RFQ AD7513SH Analog Devices Inc microcircuit linear Avl RFQ AD7513KH Analog Devices Inc microcircuit linear Avl RFQ 1826-1020 Hewlett Packard Co microcircuit linear Avl RFQ 1826-0154 Hewlett Packard Co microcircuit linear Avl RFQ
Characteristics Data of NSN 5962010551872MRC Criteria Characteristic ADAR BODY OUTSIDE DIAMETER 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM ADAU BODY HEIGHT 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 450.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/FIELD EFFECT TRANSISTOR SWITCH AND MEDIUM SPEED CQSJ INCLOSURE MATERIAL GLASS AND METAL CQSZ INCLOSURE CONFIGURATION CAN CQZP INPUT CIRCUIT PATTERN 2 CHANNEL CSSL DESIGN FUNCTION AND QUANTITY 2 SWITCH, ANALOG CTFT CASE OUTLINE SOURCE AND DESIGNATOR T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL CWSG TERMINAL SURFACE TREATMENT TIN CZEQ TIME RATING PER CHACTERISTIC 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/FIELD EFFECT TRANSISTOR SWITCH AND MEDIUM SPEED |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CQZP | INPUT CIRCUIT PATTERN | 2 CHANNEL |
| CSSL | DESIGN FUNCTION AND QUANTITY | 2 SWITCH, ANALOG |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| CZEQ | TIME RATING PER CHACTERISTIC | 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |