NSN 5962-01-064-9576 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962010649576 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010649576 |
| NCB Code: USA (01) |
| Manufacturers: Freescale Semiconductor Inc , National Semiconductor Corp , Tektronix Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SCM62462L, MCM10144L, DM10414J, DM10414C-J, 156-0657-00 under NSN 5962-01-064-9576 of Microcircuit Memory manufactured by Freescale Semiconductor Inc, National Semiconductor Corp, Tektronix Inc.
Federal Supply Class of NSN 5962-01-064-9576 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-064-9576, 5962010649576
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Part No Manufacturer Item Name QTY RFQ SCM62462L Freescale Semiconductor Inc microcircuit memory Avl RFQ MCM10144L Freescale Semiconductor Inc microcircuit memory Avl RFQ DM10414J National Semiconductor Corp microcircuit memory Avl RFQ DM10414C-J National Semiconductor Corp microcircuit memory Avl RFQ 156-0657-00 Tektronix Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010649576MRC Criteria Characteristic ADAQ BODY LENGTH 0.785 INCHES MAXIMUM ADAT BODY WIDTH 0.295 INCHES MAXIMUM ADAU BODY HEIGHT 0.180 INCHES MAXIMUM AFGA OPERATING TEMP RANGE +0.0/+75.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -55.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND W/ENABLE AND HIGH SPEED AND WIRE-OR OUTPUTS CQSJ INCLOSURE MATERIAL CERAMIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM EMITTER-COUPLED LOGIC CQZP INPUT CIRCUIT PATTERN 13 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 8.0 VOLTS NOMINAL POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE RAM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.295 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -55.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND W/ENABLE AND HIGH SPEED AND WIRE-OR OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | EMITTER-COUPLED LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 8.0 VOLTS NOMINAL POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |