NSN 5962-01-070-7535 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962010707535 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010707535 |
| NCB Code: USA (01) |
| Manufacturers: Intersil Corporation , Philips Semiconductors Inc , Harris Corporation , National Semiconductor Corp , Harris Technical Services Corp |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TM5623MDE 883C, S82S129F 883C, HPROM-1-1024-8, DM7574J 883C, 247ASC2520-036 under NSN 5962-01-070-7535 of Microcircuit Memory manufactured by Intersil Corporation, Philips Semiconductors Inc, Harris Corporation, National Semiconductor Corp, Harris Technical Services Corp.
Federal Supply Class of NSN 5962-01-070-7535 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-070-7535, 5962010707535
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Part No Manufacturer Item Name QTY RFQ TM5623MDE 883C Intersil Corporation microcircuit memory Avl RFQ S82S129F 883C Philips Semiconductors Inc microcircuit memory Avl RFQ HPROM-1-1024-8 Harris Corporation microcircuit memory Avl RFQ HPROM-1-1024-8 Intersil Corporation microcircuit memory Avl RFQ DM7574J 883C National Semiconductor Corp microcircuit memory Avl RFQ 247ASC2520-036 Harris Technical Services Corp microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010707535MRC Criteria Characteristic ADAQ BODY LENGTH 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.185 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND PROGRAMMABLE CQSJ INCLOSURE MATERIAL CERAMIC OR GLASS OR METAL CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN TRIPLE 1 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 30003-247AS-C2520 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC OR GLASS OR METAL |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | TRIPLE 1 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 30003-247AS-C2520 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |