NSN 5962-01-072-4089 of Microcircuit Digital - Parts Details
Alternative NSN: 5962010724089 |
Item Name: Microcircuit Digital |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 010724089 |
NCB Code: USA (01) |
Manufacturers: Woodward Governor Company , Intersil Corporation , Fairchild Semiconductor Corp , Freescale Semiconductor Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 1688-767, CD4013BE, F4013BPC, MC14013BCP under NSN 5962-01-072-4089 of Microcircuit Digital manufactured by Woodward Governor Company, Intersil Corporation, Fairchild Semiconductor Corp, Freescale Semiconductor Inc.
Federal Supply Class of NSN 5962-01-072-4089 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-072-4089, 5962010724089
Characteristics Data of NSN 5962010724089MRC Criteria Characteristic ABKW OVERALL HEIGHT 0.350 INCHES MAXIMUM ADAQ BODY LENGTH 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM ADAU BODY HEIGHT 0.105 INCHES MINIMUM AND 0.180 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 500.0 MILLIWATTS AFGA OPERATING TEMP RANGE -40.0/+85.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED W/CLOCK AND W/RESET AND HIGH VOLTAGE AND POSITIVE OUTPUTS CQSJ INCLOSURE MATERIAL PLASTIC CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN DUAL 4 INPUT CSSL DESIGN FUNCTION AND QUANTITY 2 FLIP-FLOP, D-TYPE CTFT CASE OUTLINE SOURCE AND DESIGNATOR MO-001AB JOINT ELECTRON DEVICE ENGINEERING COUNCIL CZEQ TIME RATING PER CHACTERISTIC 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
MRC | Criteria | Characteristic |
---|---|---|
ABKW | OVERALL HEIGHT | 0.350 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.105 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -40.0/+85.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | W/CLOCK AND W/RESET AND HIGH VOLTAGE AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | PLASTIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 FLIP-FLOP, D-TYPE |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | MO-001AB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |