NSN 5962-01-075-6870 of Microcircuit Memory - Parts Details
Alternative NSN: 5962010756870 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 010756870 |
NCB Code: USA (01) |
Manufacturers: Raytheon Aircraft , Philips Semiconductors Inc , Intersil Corporation , Mmi Amd , Dla Land And Maritime , Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 3542391, 82S129, 932684-501B, B1584-501B, CC1643 under NSN 5962-01-075-6870 of Microcircuit Memory manufactured by Raytheon Aircraft, Philips Semiconductors Inc, Intersil Corporation, Mmi Amd, Dla Land And Maritime.
Federal Supply Class of NSN 5962-01-075-6870 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-075-6870, 5962010756870
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Part No Manufacturer Item Name QTY RFQ 3542391 Raytheon Aircraft microcircuit memory Avl RFQ 82S129 Philips Semiconductors Inc microcircuit memory Avl RFQ 932684-501B Raytheon Aircraft microcircuit memory Avl RFQ B1584-501B Intersil Corporation microcircuit memory Avl RFQ CC1643 Philips Semiconductors Inc microcircuit memory Avl RFQ HM9-7611 Intersil Corporation microcircuit memory Avl RFQ MM5301 Mmi Amd microcircuit memory Avl RFQ ROM PROM FAMILY 021 Dla Land And Maritime microcircuit memory Avl RFQ SD959 Mmi Amd microcircuit memory Avl RFQ SN54S287W Texas Instrument Inc microcircuit memory Avl RFQ SN90932W Texas Instrument Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010756870MRC Criteria Characteristic ADAQ BODY LENGTH 0.400 INCHES MAXIMUM ADAT BODY WIDTH 0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM ADAU BODY HEIGHT 0.085 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED PROGRAMMED CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 10 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TTQY TERMINAL TYPE AND QUANTITY 16 FLAT LEADS
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.400 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.325 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | PROGRAMMED |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |