NSN 5962-01-076-8400 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962010768400 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010768400 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Philips Semiconductors Inc , Dla Land And Maritime , Intersil Corporation , Raytheon Aircraft , Mmi Amd |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SN54S288W, S82S123W, ROM PROM FAMILY 019, HM9-7603-2, CC5190-36 under NSN 5962-01-076-8400 of Microcircuit Digital manufactured by Texas Instrument Inc, Philips Semiconductors Inc, Dla Land And Maritime, Intersil Corporation, Raytheon Aircraft.
Federal Supply Class of NSN 5962-01-076-8400 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-076-8400, 5962010768400
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Part No Manufacturer Item Name QTY RFQ SN54S288W Texas Instrument Inc microcircuit digital Avl RFQ S82S123W Philips Semiconductors Inc microcircuit digital Avl RFQ ROM PROM FAMILY 019 Dla Land And Maritime microcircuit digital Avl RFQ HM9-7603-2 Intersil Corporation microcircuit digital Avl RFQ CC5190-36 Philips Semiconductors Inc microcircuit digital Avl RFQ B2051-36 Intersil Corporation microcircuit digital Avl RFQ 932821-36 Raytheon Aircraft microcircuit digital Avl RFQ 18319 Mmi Amd microcircuit digital Avl RFQ
Characteristics Data of NSN 5962010768400MRC Criteria Characteristic ADAQ BODY LENGTH 0.440 INCHES MAXIMUM ADAT BODY WIDTH 0.248 INCHES MINIMUM AND 0.325 INCHES MAXIMUM ADAU BODY HEIGHT 0.085 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 910.0 MILLIWATTS AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND 3-STATE OUTPUT AND SCHOTTKY AND HIGH SPEED AND EXPANDABLE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/ENABLE AND W/DI CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION FLAT PACK CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC CQZP INPUT CIRCUIT PATTERN 6 INPUT CZEQ TIME RATING PER CHACTERISTIC 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 84.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TEST TEST DATA DOCUMENT 82577-932821 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.248 INCHES MINIMUM AND 0.325 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 910.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND 3-STATE OUTPUT AND SCHOTTKY AND HIGH SPEED AND EXPANDABLE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/ENABLE AND W/DI |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 84.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST | TEST DATA DOCUMENT | 82577-932821 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |