NSN 5962-01-077-2849 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962010772849 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010772849 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instrument Inc , Intersil Corporation |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers TIDM286J, HM1-0041-8, 058-002081-001 under NSN 5962-01-077-2849 of Microcircuit Memory manufactured by Texas Instrument Inc, Intersil Corporation.
Federal Supply Class of NSN 5962-01-077-2849 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-077-2849, 5962010772849
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Part No Manufacturer Item Name QTY RFQ TIDM286J Texas Instrument Inc microcircuit memory Avl RFQ HM1-0041-8 Intersil Corporation microcircuit memory Avl RFQ 058-002081-001 Intersil Corporation microcircuit memory Avl RFQ 058-002081-001 Texas Instrument Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010772849MRC Criteria Characteristic ADAQ BODY LENGTH 0.640 INCHES MINIMUM AND 0.795 INCHES MAXIMUM ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.205 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 400.0 MILLIWATTS AFGA OPERATING TEMP RANGE -65.0/+150.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+200.0 DEG CELSIUS CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND MEDIUM SPEED CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM CURRENT-MODE LOGIC CQZP INPUT CIRCUIT PATTERN 8 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 35.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE DIODE MATRIX TEST TEST DATA DOCUMENT 26916-058-002081 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING D TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.640 INCHES MINIMUM AND 0.795 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.205 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 400.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+200.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND MEDIUM SPEED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | CURRENT-MODE LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 8 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 35.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | DIODE MATRIX |
| TEST | TEST DATA DOCUMENT | 26916-058-002081 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING D |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |