NSN 5962-01-078-0468 of Microcircuit Digital - Parts Details
| Alternative NSN: 5962010780468 |
| Item Name: Microcircuit Digital |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010780468 |
| NCB Code: USA (01) |
| Manufacturers: G E C Marconi Communications Ltd , Selex Elsag Ltd , General Semiconductor Inc , General Instrument Corp , Anadex Inc , L 3 Communications |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers SS31964-1, AY3-1015PLASTIC, AY-3-1015D, AY-3-1015, AY-3-10105 under NSN 5962-01-078-0468 of Microcircuit Digital manufactured by G E C Marconi Communications Ltd, Selex Elsag Ltd, General Semiconductor Inc, General Instrument Corp, Anadex Inc.
Federal Supply Class of NSN 5962-01-078-0468 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-078-0468, 5962010780468
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Part No Manufacturer Item Name QTY RFQ SS31964-1 G E C Marconi Communications Ltd microcircuit digital Avl RFQ SS31964-1 Selex Elsag Ltd microcircuit digital Avl RFQ AY3-1015PLASTIC General Semiconductor Inc microcircuit digital Avl RFQ AY-3-1015D General Semiconductor Inc microcircuit digital Avl RFQ AY-3-1015 General Semiconductor Inc microcircuit digital Avl RFQ AY-3-10105 General Instrument Corp microcircuit digital Avl RFQ 3130-5028-15 Anadex Inc microcircuit digital Avl RFQ 046-97-00592 L 3 Communications microcircuit digital Avl RFQ
Characteristics Data of NSN 5962010780468MRC Criteria Characteristic ADAQ BODY LENGTH 1.970 INCHES NOMINAL ADAT BODY WIDTH 0.460 INCHES NOMINAL ADAU BODY HEIGHT 0.070 INCHES NOMINAL AEHX MAXIMUM POWER DISSIPATION RATING 3.0 WATTS AFGA OPERATING TEMP RANGE +0.0/+70.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND ASYNCHRONOUS AND W/BUFFERED OUTPUT AND W/ENABLE AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 21 INPUT CSSL DESIGN FUNCTION AND QUANTITY 1 RECEIVER, ASYNCHRONOUS AND 1 TRANSMITTER CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 16.0 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT TTQY TERMINAL TYPE AND QUANTITY 40 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.970 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.460 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.070 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 3.0 WATTS |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND ASYNCHRONOUS AND W/BUFFERED OUTPUT AND W/ENABLE AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 21 INPUT |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 RECEIVER, ASYNCHRONOUS AND 1 TRANSMITTER |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 16.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |