NSN 5962-01-081-9132 of Microcircuit Memory - Parts Details
| Alternative NSN: 5962010819132 |
| Item Name: Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010819132 |
| NCB Code: USA (01) |
| Manufacturers: Saab Ab Publ Business Area Surveillance Ew Systems Jarfalla , Saab Ab Publ Business Area Surveillance Ew Systems , Texas Instrument Inc , National Semiconductor Corp , Intel Corp Sales Office , Freescale Semiconductor Inc , Raytheon Aircraft , Fairchild Semiconductor Corp , Advanced Micro Devices Inc , Bae Systems , Honeywell International Inc , Ge Aviation Systems Llc , Thales Communications Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers ZD2608 1, ZD2600 1, MPM10039J, MM2716QM 883B, MD2716M B under NSN 5962-01-081-9132 of Microcircuit Memory manufactured by Saab Ab Publ Business Area Surveillance Ew Systems Jarfalla, Saab Ab Publ Business Area Surveillance Ew Systems, Texas Instrument Inc, National Semiconductor Corp, Intel Corp Sales Office.
Federal Supply Class of NSN 5962-01-081-9132 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-081-9132, 5962010819132
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Part No Manufacturer Item Name QTY RFQ ZD2608 1 Saab Ab Publ Business Area Surveillance Ew Systems Jarfalla microcircuit memory Avl RFQ ZD2608 1 Saab Ab Publ Business Area Surveillance Ew Systems microcircuit memory Avl RFQ ZD2600 1 Saab Ab Publ Business Area Surveillance Ew Systems microcircuit memory Avl RFQ ZD2600 1 Saab Ab Publ Business Area Surveillance Ew Systems Jarfalla microcircuit memory Avl RFQ MPM10039J Texas Instrument Inc microcircuit memory Avl RFQ MM2716QM 883B National Semiconductor Corp microcircuit memory Avl RFQ MD2716M B Intel Corp Sales Office microcircuit memory Avl RFQ MD2716 B Intel Corp Sales Office microcircuit memory Avl RFQ MCM2716BJBE Freescale Semiconductor Inc microcircuit memory Avl RFQ MB2716 B Intel Corp Sales Office microcircuit memory Avl RFQ H990762-001B Raytheon Aircraft microcircuit memory Avl RFQ F2716DLQB Fairchild Semiconductor Corp microcircuit memory Avl RFQ AM2716DMB Advanced Micro Devices Inc microcircuit memory Avl RFQ AM2716DLB883B Advanced Micro Devices Inc microcircuit memory Avl RFQ AM2716-450 BJA Advanced Micro Devices Inc microcircuit memory Avl RFQ 438251-01 Bae Systems microcircuit memory Avl RFQ 4051272-0701 Raytheon Aircraft microcircuit memory Avl RFQ 4038935-416 Honeywell International Inc microcircuit memory Avl RFQ 163386-02 Ge Aviation Systems Llc microcircuit memory Avl RFQ 115372-0003 Thales Communications Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962010819132MRC Criteria Characteristic ADAQ BODY LENGTH 1.290 INCHES MAXIMUM ADAT BODY WIDTH 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM ADAU BODY HEIGHT 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS AFJQ STORAGE TEMP RANGE -65.0/+125.0 DEG CELSIUS CBBL FEATURES PROVIDED MONOLITHIC AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND W/ENABLE AND W/DECODED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 11 INPUT CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 26.5 VOLTS MAXIMUM POWER SOURCE CZEQ TIME RATING PER CHACTERISTIC 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT CZER MEMORY DEVICE TYPE ROM CZZZ MEMORY CAPACITY UNKNOWN TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND W/ENABLE AND W/DECODED OUTPUT AND PROGRAMMABLE AND PROGRAMMED AND W/BUFFERED OUTPUT AND 3-STATE OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 26.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |