NSN 5962-01-102-3575 of Microcircuit Memory - Parts Details
Alternative NSN: 5962011023575 |
Item Name: Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011023575 |
NCB Code: USA (01) |
Manufacturers: Fairchild Semiconductor Corp , Gould Inc Simulation Systems Division , Freescale Semiconductor Inc , National Semiconductor Corp , Texas Instrument Inc |
ASAP Aviation Procurement, owned and operated by ASAP Semiconductor, is the latest parts procurement platform for the aerospace and aviation industry. Check out high demanding part numbers 2708DC, ES52SPL-70P08, MCM2708C, MM2708Q, TMS2708JL under NSN 5962-01-102-3575 of Microcircuit Memory manufactured by Fairchild Semiconductor Corp, Gould Inc Simulation Systems Division, Freescale Semiconductor Inc, National Semiconductor Corp, Texas Instrument Inc.
Federal Supply Class of NSN 5962-01-102-3575 is FSC 5962 contains part details of Microcircuits Electronic. Quote for your desired part numbers.
Part Number's List for NSN 5962-01-102-3575, 5962011023575
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Part No Manufacturer Item Name QTY RFQ 2708DC Fairchild Semiconductor Corp microcircuit memory Avl RFQ ES52SPL-70P08 Gould Inc Simulation Systems Division microcircuit memory Avl RFQ MCM2708C Freescale Semiconductor Inc microcircuit memory Avl RFQ MM2708Q National Semiconductor Corp microcircuit memory Avl RFQ TMS2708JL Texas Instrument Inc microcircuit memory Avl RFQ
Characteristics Data of NSN 5962011023575MRC Criteria Characteristic ADAQ BODY LENGTH 1.290 INCHES MAXIMUM ADAT BODY WIDTH 0.600 INCHES MAXIMUM ADAU BODY HEIGHT 0.205 INCHES MAXIMUM AEHX MAXIMUM POWER DISSIPATION RATING 800.0 MILLIWATTS AFGA OPERATING TEMP RANGE +0.0 TO 70.0 DEG CELSIUS CBBL FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMABLE AND STATIC OPERATION AND ULTRAVIOLET ERASABLE AND 3-STATE OUTPUT CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE CQWX OUTPUT LOGIC FORM METAL OXIDE-SEMICONDUCTOR LOGIC CQZP INPUT CIRCUIT PATTERN 11 INPUT CRHL BIT QUANTITY 8192 CSWJ WORD QUANTITY 1024 CWSG TERMINAL SURFACE TREATMENT SOLDER CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 15.0 VOLTS MAXIMUM POWER SOURCE CZER MEMORY DEVICE TYPE ROM TEST TEST DATA DOCUMENT 57230-ES01BIN-0001 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). TTQY TERMINAL TYPE AND QUANTITY 24 PRINTED CIRCUIT
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.205 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 800.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | +0.0 TO 70.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND PROGRAMMABLE AND STATIC OPERATION AND ULTRAVIOLET ERASABLE AND 3-STATE OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
CRHL | BIT QUANTITY | 8192 |
CSWJ | WORD QUANTITY | 1024 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 15.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 57230-ES01BIN-0001 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |